Molex will debut the Impulse Orthogonal Direct Backplane Connector System at the DesignCon 2017 Expo, Booth 619, February 1-2 in Santa Clara, Calif.
Designed for high-density data center applications, the new Impulse connector system supports data rates of 56 Gbps NRZ and 112 Gbps PAM4 with superior signal integrity.
The 2.00 mm column-to-column pitch of the Impulse system delivers high-speed connectivity in a compact size. The innovative signal interface improves insertion loss over traditional in-line interface, pushing resonance beyond 35 GHz.
“Data centers are expected to deliver ever-faster data rates. However, as speeds increase, insertion loss and ICR margin become issues,” said Bratislav Kostic, new product development manager, Molex. “Impulse orthogonal direct connectors offer exceptional signal integrity performance, improved airflow and cost savings by eliminating the need to build and install mid-plane connections.”
The Impulse connector design provides an innovative contact interfaces in which all signal contacts are pre-loaded, positioned and protected in individual slots. Robust guiding features ensure proper connector alignment and mating.
The Molex OD portfolio of backplane connectors includes the Impact (sub 25 Gbps) and Impact zX2 (28 Gbps), Impel (40 Gbps) and Impel Plus (56 Gbps), and Impulse (56/112 Gbps). All of these scalable solutions deliver a stable channel impedance and help decrease system-level applied costs by eliminating the chassis mid-plane.
“As data rates climb, data centers need easy scalability in equipment to minimize future infrastructure investments. Impulse orthogonal direct backplane connectors are forward compatible to meet future data rate needs without having to replace infrastructure,” adds Kostic.
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