At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O 80-Circuit Interconnect System, which offers the highest port density (number of high-speed differential lanes) and speed (25 Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.
The system’s flexible pinout concept (continuous Ground-Signal-Signal-Ground) optimizes it for high-speed applications and maximizes the number of high-speed lanes within the lengths provided. Eight lanes (80 circuit) are available, per industry standard.
The system’s small form factor (5mm × 23mm × 9mm) and a 12mm mated connector-to-cable assembly height for right angle cable exit) allow it to service mobile devices through enterprise applications. Staggered, reliable and constant dual-row contact configuration delivers hot pluggability (the ability to add components without shutting down the system). Also, the connector provides optimal routing for high-speed trace connections while reducing the need for PCB real estate.
Storage systems applications for the Nano-Pitch I/O 80-Circuit Interconnect System include data center and enterprise storage systems, storage racks, JBODs, storage controllers, HBA servers, and RAIDS. Telecommunications/networking applications for the connector include hubs, servers, switches, and routers.
Molex
www.molex.com
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