Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This two-component epoxy features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1 KHz. “EP110F8-5 is an […]