Samtec, Inc. has expanded its AcceleRate HP product family with the addition of the APM6 and APF6 array connectors. These new connectors provide an 800-position configuration in a compact 5mm stack height, designed to meet the requirements of modern high-speed systems.
The APM6 and APF6 connectors are built on a 0.635mm pitch and support data rates up to 112 Gbps PAM4. With eight rows of 100 positions, the connectors achieve a dense footprint of 68.62mm by 18.20mm, making them suitable for applications where space efficiency and high throughput are critical.
Engineers can rely on protocol compatibility with PCIe 6.0, CXL 3.2, and 100 GbE, ensuring flexibility across multiple platforms. The design features a 5 Ohm impedance, a maximum current rating of 2 A per pin (one pin powered per row), and voltage ratings up to 150 VAC or 212 VDC.
Samtec’s open pin field array design provides grounding and routing flexibility, while the use of Solder Column Termination improves structural integrity. This termination method, compliant with IPC Class 3, enhances solder joint reliability and maintains signal performance for insertion loss and return loss. A 10mm version of the connectors is planned for release in Q2 2026.
The APM6 and APF6 connectors are available directly from Samtec and through authorized distribution partners
Leave a Reply
You must be logged in to post a comment.