Molex Incorporated announced today that its SolderRight TM Direct Solder Terminals are now available to fulfill direct solder wire-to-board designs where a very low profile right angle solder option for wires exiting a PCB is necessary due to severe space constraints. This robust solder terminal enables a secure and reliable connection with a minimal “z” profile.
In addition to a very low profile, the SolderRight one-piece crimp solder terminal includes unique design features such as multiple terminal and wire sizes, solder pins positioned between insulation and conductor crimps, and twin solder pins. Terminal wire sizes range from 14 to 28 AWG enabling both signal and power current capability while optimizing PCB space. Solder pins positioned between insulation and conductor crimps offer superior wire strain relief and resist terminal and solder join breakage. Molex twin solder pins provide stability for solder processing and allow redundant current paths.