To meet the needs of the LRM IMA (Line Replaceable Module Integrated Modular Architecture) market, the MODUL R connector combines modularity and high performance for harsh environments. It was created in response to the electronic packaging evolution requiring resistance, size and weight reduction along with easy maintenance and modularity.
“Modul R can adapt itself to customer needs regardless of the nature, the function of the card, or the box” said Gregory Devineau, Manager of the Aerospace at Amphenol Socapex.
Key features and benefits of this new product include: Modularity and high performance with 6U and 3U formats for all size packaging adaptation and large range of modules; high speed (to 15 GB/s transmission); high density, signal, power (10, 36 and 70 A) to be configured according to specific needs; high resistance to harsh environments with ruggedized mechanical interface (shocks and vibration) and an EMI (electro magnetic interference) protection ; and compatibility with thermal clamps offering a ± 0.4-mm lateral displacement
Currently dual source, this new connector will be standardized within the framework of European projects (CORAC, GENOME, IDEE5, Primae, etc.).