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Connector Tips has connector and electrical connector news, product highlights and and editorial coverage.

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Basics

What are nanominiature or Nano-D connectors?

June 6, 2017 By Mary Gannon 2 Comments

UltiMate-NanoD-Wired-Single-Row-Single-Ended

Nanominiature or nano-D connectors are offered as both rectangular and circular high-density assemblies. Most of these tiny interconnects use twist pin contact technology to provide a reliable connection even in harsh conditions that encounter shock and vibration, all with low separation force and engagement. Those manufactured by Ulti-Mate use a stamped and formed contact system […]

Filed Under: Basics, DW sync

MicroQSFP, QSFPDD,OSFP interconnect systems chosen by IEEE

April 24, 2017 By Ed Cady Leave a Comment

Just recently in Vancouver, the Ethernet IEEE-802.3cd Standards Committee voted yes simultaneously to include MicroQSFP, QSFP-DD and OSFP interconnect modules as MDI (media dependent interface) options. The remarkable singular vote, of 66 yes, 0 no, and 14 abstain, seemed to reflect the wide and deep need to support different types of new and established enterprise, […]

Filed Under: Basics, EE sync, Industry News, Markets, Telecom/Data

What does the coding mean on M12 connectors?

March 1, 2017 By Mary Gannon 1 Comment

Turck-M12-feature

M12 connectors are circular connectors with a 12-mm locking thread used for sensors, actuators, Fieldbus and industrial Ethernet, primarily in factory automation applications. Often with ratings ofIP65, IP68 and IP69K, they are ideal for washdown and corrosive environments. They are available with 3, 4, 5, 8 and 12 pins. While higher pin counts are not planned, […]

Filed Under: Automation, Basics, DW sync, Markets Tagged With: binder, Turck

Behind TE Connectivity’s new Sliver internal cabled interconnects

February 16, 2017 By Mary Gannon Leave a Comment

TE-Connectivity-Sliver

Last month, TE Connectivity launched one of its thinnest assemblies for speeds of 25 Gbps (and even possibly 50 Gbps) with its new Sliver internal cabled interconnects. Offering a flexible design for making internal input/output (I/O) connections on the board, TE said this new technology simplifies design and helps lower overall costs by eliminating the […]

Filed Under: Basics, EE sync, Industry News, Products, Telecom/Data Tagged With: TE, teconnectivity

OSFP interconnect: what is it?

January 18, 2017 By Ed Cady Leave a Comment

OSFP interconnect

OSFP, Octal Small Formfactor Pluggable, is a very new module and interconnect system in development that is targeted to support 400-G optical data links inside datacenters, campuses and external metro long reach. The private consortium OSFP MSA group was founded by Google and is led by Arista Networks. This consortium already has more than 50 […]

Filed Under: Basics, Industry News, Telecom/Data

What’s going on with COBO’s new inside-the-box module connectors?

January 4, 2017 By Mary Gannon Leave a Comment

cobo's inside-the-box module connectors

The Consortium for On Board Optics, called COBO, is developing new inside-the-box standards for onboard optical interconnects first for inside high-speed datacenters. The primary driving elements of this type of packaging and connectivity is power/cooling costs savings and port count density versus the traditional pluggable module and AOC approaches. Their first application is being driven […]

Filed Under: Basics, Featured, Industry News

Top 6 connector stories of the year

December 22, 2016 By Mary Gannon Leave a Comment

Press_fit_2-feature

Interconnects, though often simple components, can be confusing to many engineers, who don’t study in-depth these critical components that help safely join machinery, cables and boards together. Not surprisingly, our readers turn to our “Connector Basics” section to find answers to some of their most common questions on how to select the right product for […]

Pages: Page 1 Page 2 Page 3 Page 4 Page 5 Page 6

Filed Under: Basics, Industry News

What are nailhead pin interconnects?

December 21, 2016 By Mary Gannon Leave a Comment

standoff-application-feature

Sometimes the simplest solutions are the best. I can’t describe how many times I sat across from an engineer describing his exotic approach to an interconnect challenge, only to show him that there is a much simpler, easier and cost effective approach to achieving the same result. It’s not the fault of the engineer, he […]

Filed Under: Basics Tagged With: precidip

Molex and TE Connectivity announce Dual Source Alliance for high-speed I/O and backplane connectors

December 13, 2016 By Mary Gannon Leave a Comment

Molex and TEConnectivity logos_lo-res

Two of the largest manufacturers of high-speed I/O and backplane manufacturers, Molex and TE Connectivity today announced that they have formed a Dual Source Alliance (DSA) agreement to each produce a new generation of high-speed input/output (I/O) and backplane connectors, and cable assemblies for data communications applications. Molex and TE will collaborate on the launch […]

Filed Under: Basics, Industry News Tagged With: Molex, teconnectivity

How does height impact socket receptacle selection?

December 8, 2016 By Mary Gannon Leave a Comment

short-vs-tall-receptacles

Many, many moons ago, as a young PCB designer, I remember my boss yelling at me to hurry up with my design. He kept barking “don’t worry about the connector, we’ll deal with it later, just put a ‘keep out’ area in that location and run the signals to dummy IO points.” There were so […]

Filed Under: Basics Tagged With: precidip

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