Phoenix Contact now offers direct plug-in connectors in a double-row configuration, ideal for high-density PCB connections. The new SDDC 1.5 connector system, featuring “SKEDD” plug-in technology, can accommodate four to 32 conductors. SKEDD technology enables direct connection to the PCB via through-contacted bore holes, without the need for tools or an additional header. The elimination […]
EE sync
ERNI USA delivers fully assembled and tested military backplanes
ERNI USA provides manufacturing and support services for military OEMs with special product requirements, performance specifications, test parameters and supply chain needs. With expertise in press-fit technology (semi- and fully-automatic), ERNI specializes in fully assembled and fully-tested military backplanes. ERNI manufactures high-quality, low-to-mid volume, high-mix military backplanes for radar equipment, drones and other military equipment. […]
Lowest profile wire-to-board connector from Hirose offers high current capability
Hirose, Downers Grove, Ill., has created an ultra low-profile wire-to-board power connector that enables the continued miniaturization of consumer and portable electronic devices. With a pitch of only 1.2 mm and a stacking height of only 1.0 mm, the DF58 Series connector presents the industry’s lowest profile when used with 28 AWG wire. The DF58 […]
TE Connectivity releases 3-in-2 memory card connectors
TE Connectivity (TE) released its 3-in-2 card connector, for enabling SIM and micro SD card connectivity in mobile phones, tablets, ultraportable devices and personal computers. This card connector’s space-efficient design features two cavities with the flexibility to accept either two SIM cards or one SIM card and one micro SD card. It saves about 20% […]
Molex Introduces Impact zX2 backplane connector system for high-speeds
Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data […]
Behind TE Connectivity’s new Sliver internal cabled interconnects
Last month, TE Connectivity launched one of its thinnest assemblies for speeds of 25 Gbps (and even possibly 50 Gbps) with its new Sliver internal cabled interconnects. Offering a flexible design for making internal input/output (I/O) connections on the board, TE said this new technology simplifies design and helps lower overall costs by eliminating the […]
Sager Electronics Celebrates 130 years
Sager Electronics, a North American distributor of interconnect, power and electromechanical components, celebrates 130 years in business. “We are most proud of our ability to adapt over the years and to the multi-generational commitment we have made to providing excellent customer service,” noted Sager Electronics’ President Frank Flynn. He continued, “From our start selling speaking […]
Molex launches BiPass I/O and backplane cable assemblies at DesignCon
Molex debuted its new BiPass I/O and Backplane Cable Assemblies at the DesignCon 2017 Expo last week in Santa Clara, CA. Combining QSFP+, ImpelTM or near-ASIC connectors with thin twinax cables, the BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112 Gbps PAM-4 (pulse-amplitude modulation) protocol. To meet […]
Leoni proves successful in transferring 56 Gbps with its QSFP connectors
One of the newest developments in the QSFP (quad small form factor pluggable) connector design is the ability to reach 50-56 Gbps. Used for high-frequency data transmission in computer centers with four data pairs, it helps to make the connection between server, storage, switch, video and communication systems. Now comes news from Leoni, a European cable and […]
New spring-loaded pins from Mill-Max feature removable pick-and-place caps for automated assembly
Mill-Max announces a new option for automated assembly of spring-loaded pins with the introduction of removable pick-and-place caps. The new 806 series features standard Mill-Max spring pins with removable caps which keep parts centered in the carrier tape pocket, present a large round target surface for vacuum pick up and are easily removed after the […]
