Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data […]
EE sync
Behind TE Connectivity’s new Sliver internal cabled interconnects
Last month, TE Connectivity launched one of its thinnest assemblies for speeds of 25 Gbps (and even possibly 50 Gbps) with its new Sliver internal cabled interconnects. Offering a flexible design for making internal input/output (I/O) connections on the board, TE said this new technology simplifies design and helps lower overall costs by eliminating the […]
Sager Electronics Celebrates 130 years
Sager Electronics, a North American distributor of interconnect, power and electromechanical components, celebrates 130 years in business. “We are most proud of our ability to adapt over the years and to the multi-generational commitment we have made to providing excellent customer service,” noted Sager Electronics’ President Frank Flynn. He continued, “From our start selling speaking […]
Molex launches BiPass I/O and backplane cable assemblies at DesignCon
Molex debuted its new BiPass I/O and Backplane Cable Assemblies at the DesignCon 2017 Expo last week in Santa Clara, CA. Combining QSFP+, ImpelTM or near-ASIC connectors with thin twinax cables, the BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112 Gbps PAM-4 (pulse-amplitude modulation) protocol. To meet […]
Leoni proves successful in transferring 56 Gbps with its QSFP connectors
One of the newest developments in the QSFP (quad small form factor pluggable) connector design is the ability to reach 50-56 Gbps. Used for high-frequency data transmission in computer centers with four data pairs, it helps to make the connection between server, storage, switch, video and communication systems. Now comes news from Leoni, a European cable and […]
New spring-loaded pins from Mill-Max feature removable pick-and-place caps for automated assembly
Mill-Max announces a new option for automated assembly of spring-loaded pins with the introduction of removable pick-and-place caps. The new 806 series features standard Mill-Max spring pins with removable caps which keep parts centered in the carrier tape pocket, present a large round target surface for vacuum pick up and are easily removed after the […]
Keystone Electronics expands and moves warehouse
Keystone Electronics has moved its warehouse and QC Lab to a new state-of-the-art facility in New Hyde Park, N.Y. This new fulfillment center incorporates Keystone’s finished goods inventory as well as its Quality Control lab and staff. The facility is a U.S. Green building, having achieved Gold Level LEED Certification from the U.S Green Building […]
Molex showcases Impulse Orthogonal Direct backplane connector at DesignCon 2017
Molex will debut the Impulse Orthogonal Direct Backplane Connector System at the DesignCon 2017 Expo, Booth 619, February 1-2 in Santa Clara, Calif. Designed for high-density data center applications, the new Impulse connector system supports data rates of 56 Gbps NRZ and 112 Gbps PAM4 with superior signal integrity. The 2.00 mm column-to-column pitch of […]
Siemon Interconnect Solutions releases test reports from UNH-IOL Open Networking Plugfest
Siemon Interconnect Solutions, a business unit of Siemon that provides custom network infrastructure solutions to OEMs, value-added resellers and system integrators, has announced the results from its participation in the University of New Hampshire InterOperability Laboratory’s (UNH-IOL) Open Networking Plugfest which took place in December of 2016. The Open Networking Plugfest examined interoperability among NOS (network operating […]
