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Connector Tips has connector and electrical connector news, product highlights and and editorial coverage.

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FAQ

What interconnects are used with memory for HPC and AI?

June 19, 2024 By Jeff Shepard Leave a Comment

High-performance computing (HPC) for artificial intelligence (AI) applications places extreme demands on memory connectors. They must deliver high-speed connectivity, high levels of signal integrity (SI), and support high-density solutions. This article reviews connector needs for Peripheral Component Interconnect Express 6.0 (PCIe 6.0), Serial Attached SCSI (SAS) including SAS 3.0, 4.0 and SAS/PCIe 5.0, and Data […]

Filed Under: AI/ML, Electronics, FAQ, Featured, Markets, Telecom/Data Tagged With: faq

How are high-speed board-to-board connectors used in ML and AI systems?

June 12, 2024 By Jeff Shepard Leave a Comment

High-speed board-to-board connectivity is evolving to meet the increasing performance demands and need for scalability of machine learning (ML) and artificial intelligence (AI) systems. The basic PCIe connectors and Card Electromechanical (CEM) form factor are still widely used to support scalability and high performance, but there are also new contenders. This article reviews the basics […]

Filed Under: FAQ, Featured Tagged With: faq

What multidrop SPE architectures are there to choose from?

June 5, 2024 By Jeff Shepard Leave a Comment

The IEEE 802.3 single-pair Ethernet (SPE) standards include multidrop and daisy-chain architectures that support applications like automotive, industrial, and smart buildings. In addition, a range of SPE connector standards are available with several environmental classifications and ratings based on mechanical, ingress, climatic/chemical, and electromagnetic (M.I.C.E) attributes. Automotive systems are a key target for SPE deployment. […]

Filed Under: FAQ, Featured Tagged With: faq

What are the performance requirements for multidrop SPE connectivity?

May 31, 2024 By Jeff Shepard Leave a Comment

Specifications are provided for the insertion loss, return loss, and mode conversion loss in the link and mixing segments of a Single-Pair Ethernet (SPE) network. Connector specifications are also provided for coupling attenuation, impedance, return loss, and dielectric strength. This article begins by briefly examining where multidrop fits in the range of Ethernet connectivity options. […]

Filed Under: EE sync, Ethernet, FAQ, Featured Tagged With: faq

What are the PHY implementations of multidrop SPE?

May 29, 2024 By Jeff Shepard Leave a Comment

There are three common physical layer (PHY) variants for multidrop Single-Pair Ethernet (SPE), basic PHY, media access controller (MAC) PHY, and transceiver. They rely on different interfaces, including a media-independent interface (MII), reduced media-independent interface (RMII), serial peripheral interface (SPI), OPEN Alliance 3-pin (OA-3P), and Ethernet advanced physical layer (Ethernet-APL). This article begins with a […]

Filed Under: Ethernet, FAQ, Featured, Markets, Telecom/Data Tagged With: faq

What are the (almost) nine IEEE Single-Pair Ethernet standards?

May 24, 2024 By Jeff Shepard Leave a Comment

Eight IEEE Single-Pair Ethernet (SPE) standards exist, and a ninth is expected to be announced next year. Current standards include 802.3bw (100BASE-T1), two types of 802.3bp (1000BASE-T1), 802.3ch (10BASE-T1) optimized for automated environments, three versions of 802.3cg (10BASE-T1S, 10BASE-T1L, and 10BASE-T1M), and the 802.3da single-pair multidrop segments enhancement standard approved in 2023. This article reviews […]

Filed Under: Ethernet, FAQ, Featured Tagged With: faq, SPE

How does multidrop SPE work?

May 22, 2024 By Jeff Shepard Leave a Comment

Multidrop capability is included in several IEEE single-pair Ethernet (SPE) standards, including the 802.3cg substandards 10BASE-T1S and 10BASE-T1M, and the newer 802.3da, which provides enhancements to 10BASE-T1M. This article begins with a brief review of SPE multidrop standards and then explores the bus timing requirements and the use of Physical Layer Collision Avoidance (PLCA) and […]

Filed Under: Ethernet, FAQ, Featured, Industrial, Markets Tagged With: faq

DCI pluggable connectors support evolving applications

May 15, 2024 By Ed Cady Leave a Comment

IO interface groups are supported by AI developers, HPC, Enterprise, and other market segment leaders, driving connector/cabling solutions using higher speed rates, varying lane counts, and pin counts. Besides supporting the very high volume pluggable Hyperscale market segment, various pluggable connector systems support other new applications and network topologies that are driving the use of […]

Filed Under: FAQ, Featured, Featured Contributions Tagged With: faq, samtec

Connector and cable interconnects solving problems and providing a path forward

April 26, 2024 By Ed Cady Leave a Comment

Past and current data center hardware systems developers occasionally require and evaluate unexpected or previously unimagined connectivity solutions. These novel solutions often require a very short development cycle and low cost of ownership targets. Leading-edge test and measurement equipment developers sometimes need a good fast solution as a bridge product before qualifying a new connector […]

Filed Under: FAQ, Featured, Medical, Military, Products Tagged With: faq

How mmWaves affect cables, connectors, and PCB traces

April 21, 2024 By Aimee Kalnoskas Leave a Comment

Millimeter-wave signals used in 5G networks provide wide bandwidth and high data rates. Signal losses, both over the air and through interconnects, bring design challenges. by Ketan Thakkar, Cinch Connectivity Millimeter wave (mmWave) signals offer engineers countless application possibilities, including ranging, object detection, and mapping. Unfortunately, mmWaves bring numerous design challenges. Not only do mmWave […]

Filed Under: Basics, connector components, Electronics, FAQ, Featured, Featured Contributions, Markets, Telecom/Data Tagged With: faq

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Featured Contributions

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

The case for vehicle 48 V power systems

SMP3 vs. SMPS: why two standards?

mmWaves bring interconnect challenges to 5G and 6G

Ensuring integrity in high-performance interconnects with connector backshells

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