TeraSignal introduced TSLink, the world’s first intelligent chip-to-module (C2M) interconnect designed to revolutionize data transmission between large ASICs and linear optical modules. Leveraging existing microcontroller resources in optical modules, the TSLink solution automates link training and performance monitoring without the need for additional digital signal processors (DSPs). TSLink dramatically reduces power consumption and latency while simplifying […]
AI/ML
How twin axial cable assemblies support high-performance computing for AI/ML systems
The high-performance computing platforms used for artificial intelligence (AI) and machine learning (ML) in hyperscale data centers need high-speed interconnects like 112 Gbps PAM 4 and faster inside the servers. High-speed interconnects are also required between the servers and storage devices. Twin axial (Twinax) cable assemblies are one way to address those needs. This article […]
