Pasternack has released a new line of 52 BMA connectors and adapters with maximum operating frequency of 22 GHz. Typical applications include blind mating, rack and panels, phased array systems. RF backplanes and high-speed switching. Pasternack’s new product line is made up of 45 connectors with VSWR as low as 1.2:1, and 7 adapters with […]
Telecom/Data
Molex Nano-Pitch I/O 8X interconnect increases port density and speed
Molex has expanded its Nano-Pitch I/O Interconnect System portfolio with the addition of 8X cables and XD (eXtra Durable) vertical board mounted connectors. Delivering data speed rates of 25 Gbps per lane, the Nano-Pitch I/O 8X Interconnect System offers industry-leading port density and multi-protocol support to internal storage, server and mobile/enterprise applications. The XD board […]
TE Connectivity launches OCP-Compliant U.2 right-angle receptacle
TE Connectivity (TE) has launched a new U.2 SFF-8639 right angle SAS connector with the highest reliability to meet the Open Compute Project (OCP) Lightning Hardware System Specification for Facebook’s PCIe-based storage unit design. This new right angle configuration complements TE’s existing portfolio of U.2 SFF-8639 connectors, providing more design options to support both SAS […]
MicroQSFP, QSFPDD,OSFP interconnect systems chosen by IEEE
Just recently in Vancouver, the Ethernet IEEE-802.3cd Standards Committee voted yes simultaneously to include MicroQSFP, QSFP-DD and OSFP interconnect modules as MDI (media dependent interface) options. The remarkable singular vote, of 66 yes, 0 no, and 14 abstain, seemed to reflect the wide and deep need to support different types of new and established enterprise, […]
Molex Introduces Impact zX2 backplane connector system for high-speeds
Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data […]
Behind TE Connectivity’s new Sliver internal cabled interconnects
Last month, TE Connectivity launched one of its thinnest assemblies for speeds of 25 Gbps (and even possibly 50 Gbps) with its new Sliver internal cabled interconnects. Offering a flexible design for making internal input/output (I/O) connections on the board, TE said this new technology simplifies design and helps lower overall costs by eliminating the […]
Molex launches BiPass I/O and backplane cable assemblies at DesignCon
Molex debuted its new BiPass I/O and Backplane Cable Assemblies at the DesignCon 2017 Expo last week in Santa Clara, CA. Combining QSFP+, ImpelTM or near-ASIC connectors with thin twinax cables, the BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112 Gbps PAM-4 (pulse-amplitude modulation) protocol. To meet […]
Leoni proves successful in transferring 56 Gbps with its QSFP connectors
One of the newest developments in the QSFP (quad small form factor pluggable) connector design is the ability to reach 50-56 Gbps. Used for high-frequency data transmission in computer centers with four data pairs, it helps to make the connection between server, storage, switch, video and communication systems. Now comes news from Leoni, a European cable and […]
Molex showcases Impulse Orthogonal Direct backplane connector at DesignCon 2017
Molex will debut the Impulse Orthogonal Direct Backplane Connector System at the DesignCon 2017 Expo, Booth 619, February 1-2 in Santa Clara, Calif. Designed for high-density data center applications, the new Impulse connector system supports data rates of 56 Gbps NRZ and 112 Gbps PAM4 with superior signal integrity. The 2.00 mm column-to-column pitch of […]
Molex spotlights high-speed data connectivity at DesignCon 2017
Molex will showcase high-speed data connectivity solutions at DesignCon 2017 in Santa Clara, Calif., February 1-2. Molex’s booth 619 will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high-performance computing applications. “As more data is generated and infrastructure moves to the cloud, next-generation I/O and cabling solutions support […]