Anderson Power Products® (APP), a leader in high power interconnect solutions, is pleased to announce a new addition to the SB® Environmental Boot Series, with the release of their SB®50 Environmental Boot. Ideal for a wide range applications both indoors and out, the SB® Environmental Boots’ soft shell provides water, dirt, chemical and UV protection […]
Telecom/Data
Angle solder with minimal “z” profile
Molex Incorporated announced today that its SolderRight TM Direct Solder Terminals are now available to fulfill direct solder wire-to-board designs where a very low profile right angle solder option for wires exiting a PCB is necessary due to severe space constraints. This robust solder terminal enables a secure and reliable connection with a minimal “z” […]
CDFP MSA’s 400gbps interoperable hot pluggable modules
The CDFP Multi-Source Agreement (MSA) is pleased to release specifications for the CDFP 2.0 interoperable hot pluggable modules. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the CDFP interface enables data rates of 25 Gbps over 16 lanes for an aggregate of 400 Gbps on a single module with excellent signal […]
Nickel PTFE-Plated DEUTSCH 38999 Connectors Offer Alternative to Cadmium
TE Connectivity (TE), a world leader in connectivity, announces a new RoHS-compliant nickel PTFE plating for its DEUTSCH standard MIL-DTL-38999 Series III connectors. Along with TE’s recently announced black zinc nickel plating, this new coating further expands TE’s response to new environmental regulations that reduce the use of cadmium. The nickel PTFE plating is Defense […]
Modular Jack: A Historical Perspective
The invention of the modular jack and plug by Edwin Charles Hardesty, Charles Krumreiich, et al of Western Electric is, I believe, one of the most important moments in connector history. To set the stage: before 1975 in America, the telephone company owned all of the phones and leased them to customers. The phones were […]
Orthogonal direct-power connector system from Molex
Molex Inc., Lisle, Ill., recently introduced the EXTreme OrthoPower orthogonal direct-power connector system designed for routing power to backplane line cards in networking and telecommunications applications. The new EXTreme OrthoPower system uses a dedicated power card to power each line card for 30.0A in-and-out-routing, delivering a total of 60.0 A per module via split-blade technology. […]
Connector consortium releases mechanical specs for 400 Gbps interface
The CDFP MSA has released draft mechanical specifications and a drawing for the new CDFP 400 Gbps interface. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the compact 400 Gbps connector form factor will enable data rates of 25 Gbps over 16 lanes with excellent signal integrity, thermal cooling properties, and […]
Interconnect system meets the needs of next-gen data transmission
Molex Inc., Lisle, Ill., has developed the compact zCD interconnect system to support next generation applications in telecommunications, networking and enterprise computing environments. The system will transmit 400 Gbps data rates (25 Gbps over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The zCD interconnect system will be on […]
