TE Connectivity (TE), a world leader in connectivity, announces a new RoHS-compliant nickel PTFE plating for its DEUTSCH standard MIL-DTL-38999 Series III connectors. Along with TE’s recently announced black zinc nickel plating, this new coating further expands TE’s response to new environmental regulations that reduce the use of cadmium. The nickel PTFE plating is Defense […]
Telecom/Data
Modular Jack: A Historical Perspective
The invention of the modular jack and plug by Edwin Charles Hardesty, Charles Krumreiich, et al of Western Electric is, I believe, one of the most important moments in connector history. To set the stage: before 1975 in America, the telephone company owned all of the phones and leased them to customers. The phones were […]
Orthogonal direct-power connector system from Molex
Molex Inc., Lisle, Ill., recently introduced the EXTreme OrthoPower orthogonal direct-power connector system designed for routing power to backplane line cards in networking and telecommunications applications. The new EXTreme OrthoPower system uses a dedicated power card to power each line card for 30.0A in-and-out-routing, delivering a total of 60.0 A per module via split-blade technology. […]
Connector consortium releases mechanical specs for 400 Gbps interface
The CDFP MSA has released draft mechanical specifications and a drawing for the new CDFP 400 Gbps interface. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the compact 400 Gbps connector form factor will enable data rates of 25 Gbps over 16 lanes with excellent signal integrity, thermal cooling properties, and […]
Interconnect system meets the needs of next-gen data transmission
Molex Inc., Lisle, Ill., has developed the compact zCD interconnect system to support next generation applications in telecommunications, networking and enterprise computing environments. The system will transmit 400 Gbps data rates (25 Gbps over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The zCD interconnect system will be on […]
