A new multi-power hybrid FPC-to-board connector provides high power capacity while reducing mounting space requirements by up to 46% compared to conventional hybrid connectors. The connector features two main power contacts supporting 4A per pin, four sub-power contacts supporting 2.5A per pin, and 10 signal contacts.
The connector measures 0.35mm pitch, 1.9mm width, 5.33mm length, and 0.6mm stacking height, enabling size reduction in portable devices while maintaining performance specifications. The design targets smartphones, wireless earbuds, smart watches and other wearable applications.
The connector offers selectable power contact configurations, providing design flexibility. Power contacts can be configured as either 4A x 2 positions plus 2.5A x 4 positions, or 8A x 2 positions, allowing adaptation to various power circuit designs.
The fully armored design covers both ends of the housing with metal for enhanced robustness and reduced risk of housing damage from misalignment during mating. A self-alignment range of ±0.32mm in pitch direction and ±0.23mm in width direction simplifies mating operation.
The connector features pick-and-place mounting compatibility for increased production efficiency. The molded plug and receptacle design helps prevent solder wicking, improving manufacturing reliability. The design simplifies PCB layout and allows greater flexibility for component placement, supporting various product architectures and form factors.
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