The CDFP MSA has released draft mechanical specifications and a drawing for the new CDFP 400 Gbps interface. Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the compact 400 Gbps connector form factor will enable data rates of 25 Gbps over 16 lanes with excellent signal integrity, thermal cooling properties, and EMI protection.
The CDFP has also issued a white paper examining industry trends, potential markets, and in-depth specifications of the interoperable CDFP module. The complimentary white paper titled CDFP Delivers 400 Gbps Today is available for download on the CDFP MSA homepage.
CDFP founder-promoters include: Avago Technologies, Brocade Communications, IBM Corporation, JDSU, Juniper Networks, Molex Incorporated, and TE Connectivity. The CDFP roster has expanded to include the following contributing member companies: FCI, Finisar, Huawei, Inphi, Mellanox Technologies, Oclaro, Semtech, and Yamaichi Electronics. The CDFP consortium is dedicated to defining specifications and promoting adoption of interoperable 400 Gbps hot pluggable modules.
Building on OIF CEI-28G VSR and IEEE 802.3 electrical and optical interface standards, the CDFP mechanical specifications provide a standard connector and module with a pluggable form factor that supports signaling up to 26 Gbps per lane with rates scalable up to 400 Gbps. The 32mm pitch CDFP interface enables OEMs to design systems of up to 5 terabytes capacity on one line card. The connector features a straight, back-route footprint. A gasket provides EMI containment and suppression. Designed to accept a broad range of heat sinks, the press-fit design ensures a robust and simple board termination.
Providing a high level of integration, performance and long-term reliability, the CDFP 400 Gbps interface is available in short- and long-body versions. The specifications are compatible for use with direct attach cables, active optical cables, and connectorized optical modules. Enabling high port density, the compact module is well suited for low power applications using copper, VCSEL or silicon photonics based technology. Designed for client-side interfaces inside the data center, the CDFP module will support up to 100 meters on MMF and 2 kilometers on SMF.
The CDFP 400 Gbps draft interface mechanical drawings and specifications are now available. Mechanical samples are available from some respective member companies. The CDFP is working to complete the full specification, including memory mapping, within this calendar year. Requests for additional information, queries and interviews may be submitted to the CDFP at www.cdfp-msa.com.