ERNI continues to expand its connector product offering to meet the growing demands of industrial control networks and motion control/drive systems. Modern industrial automation networks utilizing programmable logic/automation controllers (PLCs/PACs), distributed control systems (DCSs), and motion control and drive systems need to handle more data traffic at increased speeds, and often in demanding environments with confined spaces. Connectors offering 1.27 mm [0.050 in.] pitch or less are becoming more common, while open pinfield interfaces offer the user maximum design flexibility for low speed and higher speed differential data.
High-density connectors like ERNI’s miniature MicroSpeed connector system, the high-performance SMC series, and the newest MicroCon family of connectors deliver the signal density, electrical performance, and mechanical dependability in smaller package sizes that help optimize today’s industrial automation systems.
The miniature MicroSpeed SMT modular connector system has a 1 mm [0.040 in.] pitch and supports high-speed data applications up to 25 Gbps. Offering exceptional signal integrity, the shielded connectors are ideal for existing and next generation communication protocols. Board-to-board stack heights between 5 and 20 mm can be achieved at effectively any desired height (due to a long 1.5 mm contact wipe length). Low inductance shielding effectiveness enables noise sensitive designs to be realized without adding costly shields within the enclosure. Featuring a flexible open pinfield design, the MicroSpeed offers several different signal-pair layouts for differential data transmission when required.
The high-performance SMC line features a number of different pincounts, heights and configurations in a 1.27 mm grid to meet a variety of application requirements. Offering secure data transmission rates up to 3 Gbps and current carrying capacity of 1.7 A per contact, the compact SMC is ideal for applications with limited space. Like MicroSpeed, the SMC family also offers a dual-beam mating interface and long contact wipe length for rugged and proven reliability on the factory floor.
The ERNI MicroCon 0.8 mm pitch product family is the newest release and design based on the proven contacts in both MicroSpeed and SMC, but further enhanced by offering this reliable two-sided female contact (dual beam) in a dense 0.8 mm [0.031 in.] pitch offering. Vertical solutions for board-to-board stacking and new extensions for perpendicular applications (midplane/backplane) will make this new product family an optimal choice for board space savings applications in a reliable/rugged interface.
“Automation processes are in a state of continual upgrade, with the hardware designer challenged with adding more intelligence and connectivity. PLC’s solve increasingly complex tasks and exchange information at increased data rates in the factory environment. Similar to requirements in the more traditional data networking space in recent past,” said Sam Hines, Product Marketing Engineer at ERNI Electronics U.S. “ERNI’s experience and history in telecom/datacom have been successfully transferred to industrial board-to-board and wire-to-board solutions over the past 10 to 15 years. Even in challenging industrial environments, our solutions ensure reliable connectivity in factory automation and in support of PLCs, DCSs, and Remote I/O solutions.”
ERNI
www.erni.com
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