ERNI Electronics has expanded its 0.8 mm MicroStac SMT connector series to encompass antimagnetic versions with 12 pin (single row) and 54 pin (dual row). The MicroStac components are based on a patented hermaphroditic design. The special design enables reduced logistic and inventory costs.
The powerful combination of the extreme miniaturization and its innovative design makes it ideal for extremely compact and demanding applications. Furthermore, the scope of applications is broad, ranging from sensor technology, medical instruments and mobile communication to automotive electronics, automation engineering, measurement, test equipment and building automation. For medical applications, new antimagnetic versions (both single row and dual row) are available now.
In spite of their extremely compact construction, MicroStac products achieve a high current-carrying capacity. The contacts are formed through precision stamping. As a result, the contacts offer an extensive cross-section for low ohmic resistance, while at the same time providing a large radiating surface that yields higher current carrying capabilities than similar competitors’ products. With an ambient temperature of 20° C and current feed to all contacts the MicroStac connectors can transfer 2.7 A per contact (9-pin version acc. with IEC 60512, test 5b).
MicroStac connectors are available with 6, 9, 10, 12 and 14 pins (all single-row), and 50 and 54 pins (both two-row). Depending on the connector, board-to-board distances from 3.0 to 6.5 mm are possible. Despite the miniaturization, the new connectors offer a high mating tolerance with allowed misalignment tolerances of longitudinal and transverse axes of ± 0.7 mm. The allowed angular inclination tolerance is specified with ± 4°.
The SMT terminals and the unique design of the MicroStac allow for economical and automatic assembly. The stability of the miniature connector is facilitated through a tilt-proof contact principle with dual-side positioning of the contact on the PCB. In addition, with its corresponding features of minimal weight (just 0.18 g for the 6-pin design), co-planarity of less than 0.1mm and suction areas integrated in the insulating body for pick-and-place assembly, the MicroStac components are perfectly suited for high-speed manufacturing.
MicroStac connectors feature a high temperature-resistant insulating body and exact coplanarity to ensure a secure soldering experience. The black isolating body allows simple visual recognition during automatic assembly and, when delivered in the antistatic tape and reel packaging, the connectors are protected and ready for automatic assembly.
ERNI Electronics
www.erni.com
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