Edge Rate high-speed, high-bandwidth interconnect systems save space on PCBs, and are designed for high-cycle, rugged applications.
With some connectors, the mating edge of the contact is the cut edge of the pin. If you look at the edge of the pin under a microscope you may see micro burrs and edges. This reduces the life of the connector because repeated cycles against those cut edges will wear-out the plating. However, the mating surface of the Edge Rate contact is the smooth, milled side of the contact. This smooth mating surface reduces wear tracks on the contact, increasing the durability and cycle life of the contact system.
The thin, narrow, cut edges of the Edge Rate contact are positioned side-by-side. This minimizes the parallel surface areas, which reduces broadside coupling and crosstalk.
Contact wipe on the 0.8 and 0.5 mm pitch products is 1.5 mm for a reliable connection. The contact is also simply designed for higher bandwidth. The contact geometry is designed, simulated, and optimized for 50 and 100 ohm systems given the contract pitch and appropriate grounding schematics.
Samtec
www.samtec.com
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