Last week during the annual DesignCon show at the Santa Clara Convention Center, a large number of manufacturers introduced new technologies and products to the marketplace, especially some ground-breaking high-speed interconnects.
Already reported here last week was the news from TE Connectivity and others about the launch of their new micro quad small-form-factor pluggable (microQSFP) high-speed I/O solutions.
Molex, too, topped the list with its new Impel backplane connectors, that help insertion loss in high-speed data signals. Molex also displayed its high-speed low-loss flex circuit assemblies, fabricated using DuPont PyraluxTK flexible circuit material and its NeoPress high-speed mezzanine system.
News of note came from Yamaichi Electronics, too, which introduced the CFP8 connector. Designed to work for 400GbE CDAUI-8 and CDAUI-16 electric signals, Yamaichi’s CFP8 products are compliant with CFP MSA design guidelines and can perform at 28 GBaud signal (28G-NRZ & 56G-PAM4) and future 56 GBaud signal (56G-NRZ & 100G-PAM4). The CN168 CFP8 series has 16 channels/32 differential pairs signal and can support Belly-to-Belly orientation on PCB; Yamaichi’s CFP8 products also come with complete mechanical accessories for both Single Port and Dual-Port designs.
Yamaichi also launched its enhanced performance version of QSFP, SFP and CFP2 connectors at DesignCon 2016. They developed to support future demand of 56G-NRZ and 100G-PAM4 signal with mechanical compatibility to existing 28G connectors. CFP2-56 connector still supports 8 channels/16 differential pairs and compliant with CFP MSA design guidelines, and it is the best fit to CFP2-ACO (Analog Coherent Optics) form factor. Yamaichi supports all mechanical accessories accompanied with the connector.
In addition, the following companies also highlighted their high-speed designs:
- Bellwether’s high speed Pogo pin connector and FFC cable can meet USB 3.0/3.1 signal integrity requirements. Both of them can provide a more flexible system architecture. Its high retention force wire-to-board connector can provide excellent 4-direction wrenching strength resistance.
- Meritec’s new Hercules High-Speed interface is used in VITA 76.0 now embedded in the new (HS-D) D-Sub rugged-rectangular MIL-DTL-24308 shell providing high-bandwidth, high-pin count and durability suitable for Mil/Aero & rugged commercial applications not previously accommodated by industry-standard connectors.
- Neoconix introduced its FPConnected family, which integrates its novel connector products into high-performance FPC assemblies. The U31C Series simplifies USB Type C implementation and terminates onboard with a low profile X-Beam connection. The XFPC Series incorporates X-Beam terminations at each end of a customer-chosen FPC length.
- Samtec, Inc. featured Silicon-to-Silicon product demonstrations featuring Flyover QSFP System, Z-Ray One-Piece Interposer, ExaMAX High-Speed Backplane and SEARAY Open Pin Field Array interconnects.
Other connector designs include:
- Amphenol’s new product offerings—RCx optimized copper intra-rack I/O system, derivatives of the Paladin Interconnect System including Ortho Mate and Cable Backplane, Cool Edge Interconnect System, 100G AOCs, and Ultraspeed high-performance PCB technology.
- AirBorn Inc.’s HD4 Interconnect Solution, which include improvements to the “inverted T” termination on the board mount connector, solid conductor and stranded wire options, enhanced backshell casing as well as UL, CSA and RoHS certifications.
- Carlisle Interconnect Technologies launched a lineup designed to deliver high signal integrity in increasingly dense applications. New products include the CoreGD and CoreHC RF adapters, Secure-Thread, one of the smallest threaded lock connectors available, and the Passive Probe, a 500Mhz CAT III/IV general-purpose, high voltage probing solution.
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