More companies are moving towards making their products Internet-of-Things-friendly, such as Intel’s Edison miniature computing platform, which can be used for IoT, wearable electronics, mobile phones and even harsh environments in industrial and automotive applications. Doing so requires robust, miniature connections, like the DF40 Series board-to-board connector from Hirose, Simi Valley, Calif. The company just announced that the postage-stamp sized Edison chip set uses the Hirose DF40 70-pin header [part # DF40C-70DP-0.4V(51)] on the board to allow developers to connect devices such as displays, keyboards, power, and other miniature devices.
The DF40 70-position receptacles are also used on Intel’s UI break-out board (part # DF40HC(3.0)-70DS-0.4V(51) and the Arduino board (part # DF40C(2.0)-70DS-0.4V(51), both which interface with the Edison.
Available in board-to-board and board-to-FPC versions, the DF40 Series connector has a 0.4 mm pitch and features a compact space-saving design with multiple stack height options from 1.5 to 4.0 mm to accommodate high-density mounting. The DF40 Series has a minimum width of 3.38 mm, which still provides sufficient vacuum area for easy pick-and-place mounting.
Despite its tiny size and low profile, the connector delivers high contact reliability with an effective mating length of 0.45 mm on the lowest 1.5 mm stacking height. A chamfered structure allows 0.33 mm of self-alignment during mating, ensuring correct insertion. In addition, the strong mating retention force of the DF40 Series connector prevents accidental unmating and uses a system that produces a clear tactile click to signal mating completion.
Durable and robust, the DF40 Series features a unique reinforced structure with shock- absorbing ribs on both sides, which minimizes damage due to physical impact or vibration. This versatile connector is also resistant to contaminants such as dust and other debris, which is achieved by a housing that covers the fine-pitched contacts when mated, minimizing debris intrusion and eliminating the potential for shorting.
“The versatile and compact DF40 Series is available in a range of stacking heights and contact positions to accommodate the needs of many types of products. The covered contact design, shock-absorbing ribs and high mating retention force provide highly reliable performance, making it ideal for applications such as mobile phones and developer chip sets,” said Rick van Weezel, Vice-President of Sales and Marketing for Hirose Electric USA.
The DF40 Series is available in various positions from 10 to 100. A shielded type is available for applications that require high-speed signal transmission and noise prevention. The rated current is 0.3A, rated voltage is 30V AC/DC, and contact resistance is limited to 90 mohms. The operating temperature is -35°C to 85°C, and the insulation resistance is at least 50 Mohms at 100 Vdc. The DF40 series is RoHS compliant and Halogen-free.
The DF40 Series connector is currently available from Mouser Electronics and other authorized Hirose distributors.
Hirose Electric Co. Ltd.
www.hirose.com/us
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