Mill-Max, the Oyster Bay, N.Y., manufacturer of precision machined interconnects, presents its first male pin carrier using thin Kapton film to create ultra-low-profile interconnects. The development greatly reduces overall connector height and size, reportedly making it ideal for locations where traditional insulator housings can’t be accommodated. This initial offering, according to the company, is an excellent design for low profile board-to-board connections.
Mill-Max ultra-low-profile interconnects
The new 3169-0-61-15-00-00-03-0 product features a double-tail PCB pin mounted in 0.005 in. thick Kapton film/tape. The tape can be easily removed after soldering but, if left in place, does not add to the interconnect height of only 0.030 in. (0.762 mm). The pins are spaced at 0.100 in. (2.54 mm) pitch, allowing for multiple pins to be assembled onto the circuit board at once and making low-volume, manual assembly more efficient. Kapton film/tape is a high temperature polyimide material suitable for all soldering processes.
The PCB pins are precision turned from brass alloy and are plated with 10 µ-in. gold providing interconnect reliability, corrosion protection and wear resistance. The packaging is a continuous strip spool of 1,000 pins, which the user can easily cut into strips of the desired number of pins. Lower quantities and alternative packaging are also available.
Mill-Max
www.mill-max.com
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