• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer
  • Advertise
  • Subscribe

Connector Tips

Connector Tips has connector and electrical connector news, product highlights and and editorial coverage.

  • Products
    • board-to-board
    • cable-to-board
    • power
    • RF
    • USB
    • wire-to-board
  • Electronics
    • bonding
    • copper
    • fiber
    • gold
    • optical
    • transistor sockets
  • Markets
    • Aerospace
    • Automation
    • Automotive
    • Electrification
    • Electrical & Instrumentation
    • Medical
    • Military
    • Off-Highway
    • Oil/Gas
    • Telecom/Data
  • Learn
    • Basics/FAQs
    • eBooks/Tech Tips
    • EE Training Days
    • EE Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • White Papers
    • DesignFast
  • Videos
    • EE Videos
    • Teardown Videos
  • Newsletter Subscription
  • Suppliers

Micro pitch board-to-board connector delivers high transmission speeds for industrial equipment

August 2, 2018 By Jillian Zavoda Leave a Comment

Hirose, has developed a miniature board-to-board connector that combines a rugged design with high-speed transmission speeds of more than 10Gpbs to support a number of industrial applications. Featuring a pitch of only 0.8mm pitch, the ER8 Series contacts are optimized for signal integrity performance, ensuring reliable high-speed performance. Now available through authorized distributors, the ER8 Series is a licensed second source for the Samtec Edge Rate Series, which is well-suited for servo motor, servo amps, AC drives, electric measuring instruments and other industrial applications.

The ER8 series offers a wide self-alignment range with reduced mating force while maintaining high extraction forces in comparison to typical micro pitch connectors. The rugged micro pitch connectors offer additional robustness when “zippered” during mating/unmating. In addition, the ER8 Series connectors have an increased contact wipe and insertion depth, making them ideal for industrial equipment that require high-mating cycles and resistance to shock and vibration.

The ER8 Series is available in parallel (mezzanine) and right angle versions. The vertical connectors are offered with pin counts ranging from 10 to 120 positions, while the right angle model is currently offered with a 120-position pin count. Featuring vertical stacking heights from 7mm to 12mm, the ER8 meets the size requirements of industrial equipment.

“As a second source with Samtec’s Edge Rate Series, the ER8 Series board-to-board connector offers customers two dependable purchase sources,” said Bill Kysiak, Product Marketing Manager for Hirose Electric USA. “We are excited to offer the ER8 Series interconnect solution through our authorized distribution partners worldwide.”

“Hirose is a leader in high-speed and miniature interconnect systems, and this partnership provides customers a reliable second source for Edge Rate products,” said Brian Vicich, Samtec’s Vice President of Engineering.

The ER8 Series features an excellent insertion loss-to-crosstalk ratio with a 5-aggressor differential far end crosstalk (FEXT) that meets the IEEE802.3ap specification for 10Gbps with plenty of margins.

The ER8 Series has a rated voltage of 100V AC, a current rating of 0.5 A.

In addition to industrial equipment, the ER8 Series is commonly used in broadcast equipment, medical equipment, multifunction printers, point-of-sale equipment, vehicle navigation, and more.

Hirose Electric
https://www.hirose.com/us/

Filed Under: EE sync, Markets, Telecom/Data Tagged With: hiroseelectric

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

Primary Sidebar

Featured Contributions

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

The case for vehicle 48 V power systems

SMP3 vs. SMPS: why two standards?

mmWaves bring interconnect challenges to 5G and 6G

Ensuring integrity in high-performance interconnects with connector backshells

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE LEARNING CENTER

EE Learning Center

RSS Current EDABoard.com discussions

  • 21V keeps getting shorted to my UART line.
  • Exporting sensor readings as data...
  • Inconsistent Charge Termination Voltage with battery charger
  • Voltage mode pushpull is a nonsense SMPS?
  • Voltage mode push pull with extra DC blocking capacitor

RSS Current Electro-Tech-Online.com Discussions

  • using a RTC in SF basic
  • Is AI making embedded software developers more productive?
  • Why can't I breadboard this oscillator?
  • Parts required for a personal project
  • Cataract Lens Options?

EE ENGINEERING TRAINING DAYS

engineering
“bills
“connector
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Footer

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Analog IC Tips
  • Battery Power Tips
  • DesignFast
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Sensor Tips
  • Test and Measurement Tips

Connector Tips

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy