Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance.
Customers looking to upgrade their line cards to meet ever-increasing data rate requirements can now do so without making major revisions to their existing infrastructure. The zX2 system is backward compatible with standard Impact headers, allowing current Impact customers to keep their existing architecture in place while upgrading their chassis’ data rates.
“We continue to see steadily increasing data rate requirements that have pushed datacom equipment developers to release faster and faster systems,” said Liz Hardin, global product manager, Molex. “The Impact Connector System was created to enable customers to design-in a high-density connector solution; with Impact zX2’s optimized signal integrity performance and ability to support more aggressive channel loss requirements, customers can extend the life of their Impact chassis.”
A common-ground structure improves crosstalk isolation, resulting in increased near-end crosstalk (NEXT) margin. Tuned to lower functional impedance to 95 Ohms, discontinuities are minimized throughout signal channels. Reduced-size compliant pins (0.36mm) on both the backplane and daughtercard modules optimizes PCB footprint which helps to further enhance the SI performance of the connector system by reducing impedance in the footprint.
The Impact upgrade, Impact zX2, is ideal for applications in several markets, including telecommunications, data/computing, aerospace and defense, and medical.