Amphenol Industrial Products Group, Sidney, N.Y., now offers a new high current PCB power connector that enables single point power delivery of 150, 200 and 300 A in less than one linear inch of a PCB edge. Amphenol’s RadFin power connectors use RADSOK contact technology to meet the increasing power requirements of printed circuit boards and the need for a smaller board footprint.
Ideal for use by data center equipment manufacturers and power supply manufacturers as well as in energy storage systems, these low profile power connectors offer flexible power delivery to PCBs enabling a variety of layout choices.
The heat dissipating design of RadFin dramatically helps reduce T-rise with minimal air-flow required.
The space-saving RadFin is offered in right angle mating planes as single-point contact terminals making them versatile when component placement is crucial. These new connectors offer superior current density compared to traditional power connectors.
These power connectors are available in solder tail, complaint pin and screw attach and mates with 6-, 8- and 10-mm diameter pin for 150, 200 or 300 A applications.
RadFin can be configured for board-to-board, wire-to-board or busbar-to-board mounting.
Amphenol Industrial Products Group