Molex introduces improvements to its best-selling PicoBlade connector that will meet the growing needs in the consumer, healthcare and industrial markets for a secure connection in rugged applications. The 1.25 pitch PicoBlade connector offers a reliable connection in both wire-to-wire and wire-to-board applications. With four header options, the PicoBlade is versatile, compact and flexible enough […]
Molex and Samtec collaborate on next-generation data center solutions
Molex and Samtec have announced a Licensed Source Agreement which brings together innovations that provide a new generation of solutions to meet the evolving needs of 56G and 112G data speeds. Molex and Samtec are the only suppliers licensed to offer the Molex BiPass and Samtec Twinax Flyover Systems to meet the needs of the […]
Molex acquires FPGA-computing system provider BittWare
Molex has acquired BittWare Inc., a global provider of computing systems featuring field-programmable gate arrays (FPGAs) deployed in data center compute and network packet processing applications. “Among the foremost FPGA computing platform developers, BittWare brings an impressive breadth of board-level computing technologies, integrated systems and software expertise,” said Tim Ruff, senior vice president of Molex. […]
Molex introduces D-Sub Earthing connector
Molex has introduced a D-Sub form factor Earthing connector to help customers make secure and robust earthing connections without the use of special tools or specialist training. The connector is designed for hash environments and meets IP66 and IP67 requirements. The Earthing connector protects equipment from stray voltages through a secure and low-impedance connection to […]
Molex introduces sealed connector system with increased reliability
Molex announces the new Squba 1.80-mm pitch sealed wire-to-wire connector system, designed to fit in small spaces and provide protection against liquid, dust and dirt. The connectors carry up to a 6.0 A current and provide an IP67 NEMA rating on the seals. Seals are retained with caps to provide manufacturers of sensors, lighting, vending […]
Molex spotlights high-speed data connectivity at Designcon 2018
Molex is showcasing its high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, Calif., this week. In its booth 633, the company will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high-performance computing applications. “As more data is generated and infrastructure moves to the cloud, next-generation I/O […]
Micro-Lock products offer security in a compact size
Molex, Lisle, Ill., has released the Micro-Lock Plus wire-to-board connector system for customers seeking high performance, compact size and retention security. Featuring a 1.5 A current rating, small footprint and positive latch, the company has reportedly developed a comprehensive terminal solution for OEMs working in space-constrained environments. Designed for industries such as automotive, consumer, and […]
Wire-to-board connector system features compact size and retention security
The Micro-Lock Plus Wire-to-Board Connector System targets applications seeking high performance, compact size and retention security. Featuring a 1.5-A current rating, small footprint and positive latch, Molex has developed this comprehensive terminal solution for OEMs working in space-constrained environments. Designed for industries such as automotive, consumer, and industrial automation, the Micro-Lock Plus Connector System is […]
Molex acquires assets of Triton Manufacturing
Molex, the global manufacturer of interconnect products and systems, announced the acquisition of certain assets of Triton Manufacturing Company, headquartered in Monee, Ill. The acquired Triton business specializes in fabricating flexible power cable assemblies and custom bus bars used in a wide range of current and heat transfer applications, including power transfer devices for computers, […]
High-speed connectivity at Supercomputing 2017
Lisle, Ill.-based Molex will present optical connectivity, structured cabling, and I/O and backplane systems for high-speed, high-density applications at the 29th Annual Supercomputing 2017 international conference and exhibition, being held this week in Denver. The company will feature high-density blind-mating optical backplane connectors for card, sled and drawer applications, and multi-fiber MT and VersaBeam expanded […]
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