Molex Inc., Lisle, Ill., recently introduced the EXTreme OrthoPower orthogonal direct-power connector system designed for routing power to backplane line cards in networking and telecommunications applications. The new EXTreme OrthoPower system uses a dedicated power card to power each line card for 30.0A in-and-out-routing, delivering a total of 60.0 A per module via split-blade technology. […]
Molex
Optical cable connectors for harsh environments
Molex Inc., Lisle, Ill., announced availability of its Expanded-Beam Ruggedized Optical Cable Assemblies, delivering highly reliable interconnects for use in harsh environments including aerospace and defense tactical communications, security communications, outside broadcast, petrochemical plant, mining and offshore systems. These easy-to-use connectors require minimal cleaning and deliver repeatable, error-free optical transmissions. They can also withstand thousands […]
Molex zCD™ AOC Interface Scalable Up To 400 Gbps
The interface of the recently released Molex Incorporated zCD™ active optical cable (AOC) interconnect solution has been selected by CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module. The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA. “We are pleased to bring […]
Molex Introduces Vertical Configuration DuraClik™ Connectors
Molex Incorporated has released a vertical configuration version of its DuraClik™ 2.00mm pitch wire-to-board connectors. The new vertical DuraClik connector is designed for on-board automotive instrumentation, including steering wheels, shift levers, wiper/blinker levers, headlights, inverters and air conditioners, in addition to electric bicycles, trucks, cranes, factory automation equipment and other high vibration applications. “DuraClik connectors […]
Mezzanine connectors in 1U packaging are your friends
Mezzanine connectors have been an important enabling technology for 1U packaging. Several electronic functions can conveniently fit into a 1U box. If you recall from previous posts, the vertical dimension in industry standard racks is based on “Rack Units” or multiples of 1.75 in. Somewhere along the way, the Rack Unit (RU) got shortened to […]
Molex Showcased NeoScaleTM High-Speed Mezzanine System at DesignCon
Molex Incorporated announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014, January 28-31, Santa Clara Convention Center in California. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, […]
High Current-Density Mega-Fit Power Connectors from Molex
Molex Incorporated continues to build on its innovative family of power products with the Mega-Fit power connector. This wire-to-board, mid-range product line fills a significant power void in today’s interconnect marketplace by delivering 23.0A in a small 5.70mm footprint. The compact design paired with the high current terminals provide one of the most power dense […]
Mezzanine connectors are compact for PCB savings
The SpeedStack mezzanine connector system from Molex Inc., Lisle, Ill., provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00 mm and support data rates up to 40 Gbps per differential pair. “There’s heightened […]
Molex SpeedStack Mezzanine Connectors Achieve 40 Gbps Data Rates
The Molex SpeedStack mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at […]
Interconnect system meets the needs of next-gen data transmission
Molex Inc., Lisle, Ill., has developed the compact zCD interconnect system to support next generation applications in telecommunications, networking and enterprise computing environments. The system will transmit 400 Gbps data rates (25 Gbps over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The zCD interconnect system will be on […]