Mezzanine connectors have been an important enabling technology for 1U packaging. Several electronic functions can conveniently fit into a 1U box. If you recall from previous posts, the vertical dimension in industry standard racks is based on “Rack Units” or multiples of 1.75 in. Somewhere along the way, the Rack Unit (RU) got shortened to […]
Molex
Molex Showcased NeoScaleTM High-Speed Mezzanine System at DesignCon
Molex Incorporated announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014, January 28-31, Santa Clara Convention Center in California. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, […]
High Current-Density Mega-Fit Power Connectors from Molex
Molex Incorporated continues to build on its innovative family of power products with the Mega-Fit power connector. This wire-to-board, mid-range product line fills a significant power void in today’s interconnect marketplace by delivering 23.0A in a small 5.70mm footprint. The compact design paired with the high current terminals provide one of the most power dense […]
Mezzanine connectors are compact for PCB savings
The SpeedStack mezzanine connector system from Molex Inc., Lisle, Ill., provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00 mm and support data rates up to 40 Gbps per differential pair. “There’s heightened […]
Molex SpeedStack Mezzanine Connectors Achieve 40 Gbps Data Rates
The Molex SpeedStack mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at […]
Interconnect system meets the needs of next-gen data transmission
Molex Inc., Lisle, Ill., has developed the compact zCD interconnect system to support next generation applications in telecommunications, networking and enterprise computing environments. The system will transmit 400 Gbps data rates (25 Gbps over 16 lanes) with excellent signal integrity, electromagnetic interference (EMI) protection and thermal cooling properties. The zCD interconnect system will be on […]
High-speed edge card connectors
Molex Inc., Lisle, Ill. has expanded its EdgeLine portfolio with the addition of its new, high-speed edge card connectors. These low-profile, one-piece products feature a high-speed differential contact design that enables speeds of up to 25 Gbps with excellent signal integrity. The products are the latest addition to the EdgeLine family, which provides cost-effective, flexible […]
Backplane connector is scalable up to 25 Gbps data rates
The Impact 100-Ohm backplane connector from Molex Inc., Lisle, Ill., combines speed and density in a modular package designed for high speed applications. The scalable Impact connector technology provides data rates up to 25 Gbps with excellent signal density up to 80 differential pairs per linear inch when using a 6-pair configuration. “Our network customers continue […]
Gold alternatives in connector designs
When the price of gold shot up in the ’80s, many connector manufacturers funded research into gold alternatives. In the early days, much of that work was focused on Palladium. As it turned out, Palladium is a rather brittle material that has a tendency to crack when formed after plating. But in the process, palladium nickel […]
How much gold is enough in connector designs?
Precious metal plating on connectors protect the surface from corrosion. Sounds pretty basic, but there is a bit more to it. There is the perception that gold is good and more gold must be better. Not necessarily so. It depends upon the application. Corrosion typically occurs when corrosive elements in the air reach the connector contact […]
