Molex, Lisle, Ill., has released the Micro-Lock Plus wire-to-board connector system for customers seeking high performance, compact size and retention security. Featuring a 1.5 A current rating, small footprint and positive latch, the company has reportedly developed a comprehensive terminal solution for OEMs working in space-constrained environments. Designed for industries such as automotive, consumer, and […]
Molex
Wire-to-board connector system features compact size and retention security
The Micro-Lock Plus Wire-to-Board Connector System targets applications seeking high performance, compact size and retention security. Featuring a 1.5-A current rating, small footprint and positive latch, Molex has developed this comprehensive terminal solution for OEMs working in space-constrained environments. Designed for industries such as automotive, consumer, and industrial automation, the Micro-Lock Plus Connector System is […]
Molex acquires assets of Triton Manufacturing
Molex, the global manufacturer of interconnect products and systems, announced the acquisition of certain assets of Triton Manufacturing Company, headquartered in Monee, Ill. The acquired Triton business specializes in fabricating flexible power cable assemblies and custom bus bars used in a wide range of current and heat transfer applications, including power transfer devices for computers, […]
High-speed connectivity at Supercomputing 2017
Lisle, Ill.-based Molex will present optical connectivity, structured cabling, and I/O and backplane systems for high-speed, high-density applications at the 29th Annual Supercomputing 2017 international conference and exhibition, being held this week in Denver. The company will feature high-density blind-mating optical backplane connectors for card, sled and drawer applications, and multi-fiber MT and VersaBeam expanded […]
Molex announces MUO 2.5 termination connection
Molex has introduced the MUO 2.5 Termination Connector, designed to replace closed-end (CE) terminals. According to officials at the Lisle, Ill., company, it will not only reduce cable assembly time for OEMs, but also improve reliability and processing time. “Traditional CE terminals can cause wire damage and cannot be disassembled after installation,” said Yujiro Enomoto, […]
Molex opens Silicon Valley technology center
Molex, based in Lisle, Ill., announced the official opening of a new technology center located in Fremont, Cal. “The new technology center will enable us to better serve our growing customer base and co-developers in the region, empower closer collaboration, and provide important access to a leading center of investment and innovation,” according to Martin […]
Molex introduces Pico-EZmate Slim
To meet industry’s need for a compact, wire-to-board connector with vertical mating, Molex, Lisle, Ill., has introduced the Pico-EZmate Slim 1.2-mm pitch wire-to-board connector. According to the company, it’s designed to provide reliable connection in a compact profile that improves both reliability and assembly speed. “As consumer electronics products get more compact, manufacturers are looking […]
Molex awarded Cisco 2017 Supply Chain Operations Supplier of the Year award
Molex announced that it has received the 2017 Supply Chain Operations Supplier of the Year Award from Cisco. This prestigious award recognizes Molex for exceeding expectations in supporting Cisco supply chain priorities and initiatives while providing differentiated contributions in the areas of quality, technology, responsiveness, flexibility, value creation, and sustainability. Molex also received the Cisco […]
Molex earns supplier award for excellence
Molex has been awarded the 2016 Supplier Excellence award by Carlton-Bates for its annual growth. Molex is the only interconnect supplier company to earn this award in the 2016 calendar year. “It is an honor to be recognized by the Carlton-Bates organization for our commitment to service, growth and development of our collective business,” said […]
Molex debuts zSFP+ interconnect system for 56 Gbps channels
Molex has expanded its zSFP+ Interconnect System to support 56 Gbps PAM-4 channels in a stacked 2xN port configuration, allowing next-generation Ethernet and Fibre Channel applications to receive standout signal integrity. The product is the first of its kind on the market. OEMs requiring high-density interconnect applications now have the ability to utilize channels with […]