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teconnectivity

zSFP+ stacked belly-to-belly connectors enable higher faceplate density

December 3, 2019 By Mary Gannon Leave a Comment

zSFP+ stacked belly-to-belly connectors

TE Connectivity has introduced its new zSFP+ stacked belly-to-belly connectors that are designed to support data rates at both 28G NRZ and 56 Gbps PAM-4. The upright latching feature for zSFP+ stacked belly-to-belly connectors is a key capability that can accommodate four row belly-to-belly applications to enable higher faceplate density and maximize printed circuit board […]

Filed Under: DW sync, EE sync, Markets, Products, Telecom/Data Tagged With: teconnectivity

369 shielded connectors for harsh environments beyond commercial aerospace

November 12, 2019 By Mary Gannon Leave a Comment

TE Connectivity 369vShielded Connector

TE Connectivity is extending its time-tested 369 connector series with the introduction of the new 369 shielded rectangular connectors for environments that demand ambient EMI noise protection. These connectors incorporate the benefits of the 369 series, which is qualified for use in a wide range of commercial aerospace applications, with EMI shielding that opens up […]

Filed Under: Aerospace, DW sync, EE sync, Markets Tagged With: teconnectivity

AMP MCP unsealed transportation connectors designed for existing bulkhead cut-outs

October 17, 2019 By Mary Gannon Leave a Comment

TE Connectivity unsealed transportation connectors

Offering improved safety and ease of assembly over other industry models, TE Connectivity launched a new addition to its unsealed connector portfolio for the transportation industry. The AMP MCP 18P monoblock connector offers trust and reliability in harsh environments for industrial and commercial transportation with its flame retardant composition and new lever design. Ideal for […]

Filed Under: Automotive, DW sync, EE sync, Markets, Off-Highway Tagged With: teconnectivity

Power connectors support next-gen needs with up to 140 A/contact

September 24, 2019 By Mary Gannon Leave a Comment

TE connectivity multi-beam power connectors

TE Connectivity today introduced Multi-Beam Plus connectors, the latest evolution of its highly-successful power connector line. They share the same low-profile dimensions and enable the same through-system airflow as previous designs such as Multi-Beam XL,  XLE and HD power connectors. Multi-Beam Plus connectors satisfy the demand for higher-power solutions by providing a high current per […]

Filed Under: Automation, DW sync, EE sync, Featured, Markets, power, Products, Telecom/Data Tagged With: teconnectivity

Edge card connectors support up to 16 Gbps speeds

September 19, 2019 By Mary Gannon Leave a Comment

TE Connectivity edge card connectors

TE Connectivity today introduced its new PCIe Gen 4 card edge connectors, which meet industry PCI-SIG Card Electromechanical (CEM) specification 4.0 and support Intel and AMD next-generation platforms with up to 16 Gbps of bandwidth. Designed to support next-generation CPUs for better system application scaling and higher bandwidth in servers, storage, workstations and desktop PCs, […]

Filed Under: DW sync, EE sync, Markets, Telecom/Data Tagged With: teconnectivity

Strada Whisper backplane connectors simplify data center system upgrades

September 13, 2019 By Mary Gannon Leave a Comment

TE connectivity strada whisper backplane connectors

TE Connectivity has introduced its Strada Whisper R backplane connectors, which make future data center system upgrades easier. A newly-optimized footprint helps ensure low crosstalk noise and enables the migration path from 56G PAM-4 to 112G PAM-4. Strada Whisper R connectors use the same mating interface and are backwards compatible with TE’s existing Strada Whisper […]

Filed Under: DW sync, EE sync, Featured, Products Tagged With: teconnectivity

Heilind Electronics adds TE Connectivity’s SOLARLOK 2.0 connector to portfolio

September 13, 2019 By Aimee Kalnoskas Leave a Comment

SOLARLOK 2.0

Heilind Electronics recently introduced TI Connectivity’s new SOLARLOK 2.0 connector. This new connector enables solar installers to make in-field panel connections more easily, quickly and cost-effectively. TE Connectivity’s SOLARLOK 2.0 is a toolless field-installable product that uses Insulation Displacement Contact (IDC) technology to create a connection between panels and cables without the need for any […]

Filed Under: power Tagged With: heilindelectronics, teconnectivity

Snap-cap electrical connectors ensure reliability in heavy equipment

August 28, 2019 By Mary Gannon Leave a Comment

TE deutsch snap-in electrical connectors dt-23p-family-press-rls

High vibration, extreme temperatures, moisture, dust, dirt and debris exposure can wreak havoc on electrical harnesses and heavy machinery in harsh agricultural, mining, and construction conditions. In its quest to enhance reliability in harsh environments and extend the trust and dependability of complex vehicle electrical systems, TE Connectivity (TE) is helping to solve this problem […]

Filed Under: DW sync, EE sync, Featured, Products Tagged With: teconnectivity

Wire-to-board power cable plugs and assemblies deliver up to 12.5 A per pin

August 20, 2019 By Mary Gannon Leave a Comment

TE Connectivity ELCON Micro wire-to-board power cable plugs and cable assemblies

TE Connectivity has launched an expanded portfolio of ELCON Micro wire-to-board products, which provides a high current up to 12.5 A per pin in the common industry footprint of 3.0 mm, and now includes custom cable assemblies and a cable plug solution for design flexibility. These new products complement TE’s ELCON Micro connectors, which were […]

Filed Under: DW sync, EE sync, Electrical/Instrumentation, Featured, Industrial, Medical, Products, Telecom/Data Tagged With: teconnectivity

Sliver straddle-mount connectors support Open Compute Project NIC 3.0

August 2, 2019 By Mary Gannon Leave a Comment

TE Connectivity Sliver Straddle-mount connectors

TE Connectivity has introduced its new Sliver straddle-mount connectors, which are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0. A new extension of the Sliver product line, these straddle-mount connectors were designed to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance […]

Filed Under: DW sync, EE sync, Markets, Products, Telecom/Data Tagged With: teconnectivity

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Featured Contributions

From extreme to mainstream: how industrial connectors are evolving to meet today’s harsh demands

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