TE Connectivity has released its new NanoRF modules and contacts, which double the density of today’s VITA 67 RF modules for VPX embedded computing applications. This high-frequency nanominiature coax contact is engineered with smaller contacts and a higher RF contact density within a multi-position module. This design enables smaller packaging and saves valuable space. Half-size […]
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Circular plastic connectors from TE meet UL and U.S. Defense criteria
TE Connectivity offers circular plastic connectors (CPC) as a standard, rugged and reliable solution suitable for multiple applications. The connectors are now UL Recognized (File No. E28476) and meet criteria for CSA Certification (LR 7189) from the United States Department of Defense. “In addition to achieving both the UL and CSA certification, TE’s CPC products […]
OSFP connectors and cable assemblies from TE Connectivity offer 400 Gbps
TE Connectivity has introduced its new Octal Small Form Factor Pluggable (OSFP) connector and cable assembly portfolio, which supports next-generation data center needs with data rates of 200 and 400 Gbps. These products are designed to support 8x28G NRZ and 8x56G PAM-4 protocols, with a roadmap to 8x112G PAM-4 for future system upgrades. TE’s OSFP […]
TE Connectivity launches online store with instant access to pricing, product inventory
TE Connectivity has launched the online TE Store, which offers customers the option to purchase featured products direct via TE.com or through select distributors, along with instant access to product pricing, daily updates on product availability, and flexible shipping and delivery options. “We know that there are millions of engineers across industries searching the internet […]
TE Connectivity introduces 124 position Sliver connectors and cable assemblies
TE Connectivity has introduced its new 124 position Sliver internal I/O connectors and cable assemblies, which provide a high-density solution that enables up to x20 signal transmission lanes, or 40 differential pairs. The 124 position Sliver connectors currently support PCIe Gen 4 and Gen 5, Ethernet 56G and SAS-5. The cable assemblies currently support PCIe […]
TE Connectivity introduces next-generation free height connectors
TE Connectivity has introduced its next-generation 0.8-mm free height board-to-board connectors, which achieve unrivaled speeds of 32 Gbps and higher. These high-speed, mid-density mezzanine solutions deliver an excellent price-to-performance ratio and are 56 Gbps PAM-4 and PCIe Gen 5 capable for future upgrades. There is a growing need for mezzanine connectors capable of delivering 25 […]
TE Connectivity partners with Annapolis Micro Systems on FPGA boards
TE Connectivity (TE) has partnered with Annapolis Micro Systems, a FPGA board and systems supplier, on the release of three new high-performance FPGA boards that feature TE’s NanoRF module. The half-size NanoRF is designed to fit into the VITA 67.3 form factor and supports 70 GHz bandwidth, with more than double the RF contact density […]
TE Connectivity’s Flex Grip wire connectors available from Sager
Sager Electronics, a North American distributor of interconnect, power and electromechanical components and provider of value-add solutions, is now stocking TE Connectivity’s Flex Grip wire cConnectors. These push-in connectors have operating levers for fast, easy and releasable wire termination and accommodate for a combination of 24–14 AWG (0.2–4.0 mm2) solid and stranded wires. The transparent body […]
Micro power connectors form TE deliver high current density
TE Connectivity (TE) has introduced its ELCON Micro power connectors, which deliver high current density in a commonly used industry footprint of 3.0 mm. The new connectors provide 12.5 A per pin, making them useful for servers, switches, storage devices and testing machines. By using a common industry footprint, TE’s ELCON Micro power connectors allow […]
Extra-large array socket tech from TE Connectivity suits next-gen data centers
TE Connectivity has introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers. The utilization of printed circuit board (PCB) substrates versus other […]