TE Connectivity reduces high-density switch design costs with zQSFP+ stacked belly-to-belly cage

TE Connectivity (TE) has launched its zQSFP+ stacked belly-to-belly cages, which support a single printed circuit board (PCB) architecture (versus two PCBs) in each line card, saving customers significant costs.

Designed for high-density switches with 48 or 64 silicon port designs, TE’s new zQSFP+ stacked belly-to-belly cages address the requirements for higher density switch designs, including Open Compute Project (OCP) reference designs. By supporting a single PCB architecture in each line card, these products reduce design and manufacturing costs. Like the rest of TE’s zQSFP+ portfolio, these cages support up to 28G NRZ and 56G PAM-4 data rates to achieve faster speeds in these high-density switches. TE’s zQSFP+ stacked belly-to-belly cages are dual-sourced with Molex and are drop-in replacements.

“These new zQSFP+ cages allow us to design denser switches while reducing costs by using just one PCB per line card,” said Melody Chiang, product manager at Accton. “TE continually supports our efforts to design faster, denser switches, and this belly-to-belly configuration is just the latest example.”

“OCP and other design initiatives are demanding higher and higher switch port density,” said Bowen Yu, product manager at TE Connectivity. “TE’s stacked zQSFP+ belly-to-belly cages help our customers deliver that density in a proven product with a secure supply chain.”

TE Connectivity Ltd.
www.te.com