TE Connectivity has launched an expanded portfolio of ELCON Micro wire-to-board products, which provides a high current up to 12.5 A per pin in the common industry footprint of 3.0 mm, and now includes custom cable assemblies and a cable plug solution for design flexibility. These new products complement TE’s ELCON Micro connectors, which were released last year. The 12.5 A per pin current density in a compact design is useful in data communications, telecommunications, consumer devices, white goods, industrial and instrumentation, medical devices and 5G applications. The use of a common industry footprint allows customers to easily upgrade existing designs.
Unlike comparable products in the market, the ELCON Micro connector housing is designed to prevent mating the plug in the wrong direction, making assembly virtually fool-proof. In addition, ELCON Micro connectors perform reliably in harsh environments thanks to their maximum operating temperature of 105°C and their halogen-free material. The 3.0 mm PCB footprint is compatible with Molex’s Micro-Fit products, and inter-matable and interchangeable with BellWether’s Micro-Hi products. TE also now provides custom cable assemblies and a cable plug solution for design flexibility.
“TE’s ELCON Micro portfolio delivers high power with extremely reliable connectivity in an easy-to-use, industry standard form factor,” said Pat DiPaola, product manager at TE Connectivity. “We now offer our customers an expanded range of ELCON Micro connectors, cable plugs and custom cable solutions for use within a broad range of applications requiring high current in compact space.”
TE Connectivity Ltd.
www.te.com
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