Molex has introduced a D-Sub form factor Earthing connector to help customers make secure and robust earthing connections without the use of special … [Read More...]
Markets
Industrial insulation displacement connectors from AVX are first with a 2.55-mm profile
AVX Corp. has released the new 9176-800 series low-profile insulation displacement connectors (IDCs), which reduce the Z-axis height of the … [Read More...]
Industry News
Molex acquires FPGA-computing system provider BittWare
Molex has acquired BittWare Inc., a global provider of computing systems featuring field-programmable gate arrays (FPGAs) deployed in data center compute and network packet processing applications. “Among the foremost FPGA computing platform … [Read More...]
New side bags for OKW’s portable instrument enclosures
OKW has added optional side bags to its CARRYTEC portable instrument enclosures – making sensors, probes and scanners readily available on the move. Robust CARRYTEC enclosures are ideal for a wide range of applications including medical and … [Read More...]
AVX earns 2017 TTI Supplier Excellence Award
AVX Corp., manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, has earned a TTI Supplier Excellence Award in the Americas region for the fourth consecutive year. Bestowed by TTI Inc., … [Read More...]
TE Connectivity recognizes top distributors
TE Connectivity (TE) presented its 2017 Distributor Awards during its recent Regional Distribution Summits held in Shanghai; Bad Neuenahr, Germany; and Orlando. The annual awards recognize TE’s highest-performing distribution partners in a specific … [Read More...]
TE Connectivity showcases 400G connector and cable assembly solutions at OFC 2018
TE Connectivity (TE) will showcase a comprehensive lineup of high-performance connectors, sockets, cable assemblies and power solutions at the OFC 2018 conference held in San Diego, March 13 −15. TE will show these solutions in the Ethernet Alliance … [Read More...]
Siemon Interconnect Solutions recognized on CRN’s Data Center 100 List
Siemon Interconnect Solutions, a business unit of The Siemon Co., announced that CRN, a brand of The Channel Co., has named Siemon Interconnect Solutions, to its 2018 Data Center 100 list. This annual list recognizes technology suppliers that excel … [Read More...]
SMK Electronics features advanced high-speed IoT network components at Mobile World Congress 2018
SMK Electronics (Europe) Ltd., a division of SMK Corp. (Japan), announced today that, for the first time, it is exhibit at Mobile World Congress 2018 at the Fira Gran Via, Barcelona, February 26 – March 1, in booth #8.0G30, NEXTech Hall. Ths company … [Read More...]
High-voltage connectors meet the demands of mission critical satellite communications
The US Air Force and a major defense contractor tapped Caton Connector Corp. of Kingston, Mass., to supply high-voltage connectors and cable assemblies for an exceptionally demanding mission-critical application: the Milstar Satellite Communications … [Read More...]
HARTING Technology Group strengthens its commitment in Mexico
The HARTING Technology Group intends to continue to expand its market position in North and Central America over the coming years, said Jon DeSouza, President and CEO of HARTING Americas, during a visit to Silao, Mexico. Since 2016, HARTING has been … [Read More...]
TE Connectivity highlights 400Gbe OSFP and QSFP-DD connectivity at DesignCon 2018
TE Connectivity (TE) today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE is demonstrating the new products in booth … [Read More...]
TE Connectivty and Credo demonstrate 112G single-lane connectivity at DesignCon 2018
TE Connectivity (TE) and Credo, provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets, today announced they have teamed up to demonstrate the future of … [Read More...]
Molex spotlights high-speed data connectivity at Designcon 2018
Molex is showcasing its high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, Calif., this week. In its booth 633, the company will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding … [Read More...]
Carlisle Interconnect Technologies unveils CoreHC and Card Edge connectors at DesignCon 2018
CarlisleIT, a division of Carlisle Companies is introducing an updated CoreHC interconnect solution and brand-new Card Edge Connectors contact system as part of its integrated line of high-performance microwave cables and precision RF and high-speed … [Read More...]
TE Connectivity showcases computing and industry innovations at DesignCon 2018
TE Connectivity (TE) will showcase its Sliver interconnects at DesignCon 2018 that have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector. Multiple groups within the industry including … [Read More...]
100G Lambda MSA releases specs for next-gen optical interconnects
The 100G Lambda Multi-Source Agreement (MSA) Group has announced the release of preliminary specifications based on 100 Gbps per wavelength PAM4 optical technology. Under the MSA, member companies addressed the technical challenges to achieving … [Read More...]
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