The Space Splice system from C&K/Littelfuse can reduce the time needed to build cable assemblies with crimps and connector housings. Building custom wiring harnesses is time-consuming, especially when you must splice wires and tie them together. The Space Splice series from C&K/Littelfuse can reduce assembly time in production. Instead of twisting and soldering wires, assemblers […]
Basics
Pluggable IO interface technology driving 224G PAM4 cable and connector developments
In this article, we’ll discuss the recent 200+G PAM4 per-lane interconnect developments supported by various consortia, standards bodies, and new product announcements. The latest 2023 Ethernet Alliance Roadmap shows the demand for 200+G per-lane pluggable modules, connectors, copper, and optical cable products by 2025. Based on their chart below and the interface roadmap, several different lane-count versions […]
Why is connector pitch important?
Contributed by Frances Richards Knowing the connector pitch is vital to ensuring compatibility with the wire or cable being connected. When designing a circuit or purchasing either connectors or cables, the connector pitch must be specified to ensure a proper connection. First, let’s define pitch: A connector’s pitch refers to the distance measured from the […]
How high pin-count socket connectors are supporting new processor-chip applications
Datacenter server processor chips have proven valuable as pluggable and removable devices for the socket connectors mounted to a server’s main PCB board. However, the number of contacts per socket connector has dramatically risen over the last few years. New chips offer 3000 to 5000 or more contact pads per flip chip. Typically, the socket […]
How the terabit class of pluggable cables and connectors is advancing
The world of gigabits began some 25 years ago, with a progression of interface lanes and links — from 100G and 200G to 400G and then 800G using IO standard and proprietary connectors and cables. Believe it or not, gigabit lanes were first used in 1999. Today, we’re entering the terabit phase with interface links […]
Are gold- or silver-plated connectors or contacts right for my application?
Learn the proper electrodeposition for contacts and connectors to ensure reliability in your electrical devices. Contributed by Luke Copp • Sales & Marketing Associate for Advanced Plating Technologies Modern manufacturing relies on critical connections made via strong electroplating, as more and more devices are connected to provide instant access to information and data. However, any electrical […]
How new USB4.2 80G cable links will support cost-effective connectivity
The USB Promoter Group recently announced the November release of the USB4 Version 2.0 specification, a significant update to enable up to 80 Gbps of data performance over the USB Type-C cable and connector. The USB Type-C and USB Power Delivery (USB PD) specifications will also be updated to enable this higher level of data […]
Connectors and cables modernize data centers
Demands for bandwidth-intensive, data-driven services are fueling a rise in compute, data storage, and networking capabilities. These rises put pressure on connectors and cable to deliver data at higher speeds with better signals and less heat.
Will internal IO copper cables for data centers become standardized?
Data-center passive DAC external cables have been standardized and interoperable for decades. However, the mating, inside-the-box cables have yet to be fully standardized. In general, inside-the-box IO interface interconnections have been a competitive value point for those OEMs and suppliers that offer quality options. Providing reliable connectors and twin-axial cables configured in an ideal layout […]
How are optical interconnects being miniaturized?
Fiber optic connector trends include a proliferation of new and smaller designs and, according to NTT, optical connector standardization activities are one of the most active areas at the International Electrotechnical Commission (IEC). As of February 2021, IEC SC 86B (Fibre optic interconnecting devices and passive components) published the second largest number of documents in […]
