SMK Electronics (Europe) Ltd., a division of SMK Corp. (Japan), announced today that, for the first time, it is exhibit at Mobile World Congress 2018 at the Fira Gran Via, Barcelona, February 26 – March 1, in booth #8.0G30, NEXTech Hall. Ths company will introduce a new family of facility automation components and technologies suitable to the IoT marketplace.
This new family of IoT network components includes miniature IDC and board-to-board connectors, waterproof USB-C connectors, high-performance pogo pins, high-speed data connectors plus a wide range of RF modules including Sigfox, LoRa and IP500 versions.
“We are very pleased with the robust performance and industry acceptance of our advanced network automation components,” said Patrick Delanoeije, Vice President, SMK Electronics. “Just recently, SMK began shipping advanced high-speed connectors for the Low Power Wide Area (LPWA) network–the world’s first fully interoperable IoT commercial facility-automation platform. Through our worldwide industry partners, R&D and manufacturing centres, and with more than 90 years’ experience in the manufacture of high quality electrical components, SMK Electronics is well positioned to provide the industry with advanced products and technologies for facility automation applications, and all aspects of the exciting future of IoT.”