Molex Inc., Lisle, Ill., has added Kapton tape to its family of Vertical Surface Mount (SMT) Modular Jacks to aid with automatic vacuum pick-and-place processes on printed circuit boards (PCBs). Delivered in tape and reel packaging, the new options help streamline high-volume production and lower manufacturing costs in the telecommunications, consumer, medical, industrial, and commercial vehicle industries.
“We have increased the flexibility for our customers in the high-volume PCB assembly space by adding product options that no longer rely solely on mechanical grippers for pick and place,” says Kieran Wright, global product manager, Molex. “By adding a Kapton tape surface to the top side of the connector, the Vertical SMT Modular Jacks from Molex can be picked and placed by vacuum heads, delivering a faster, more cost-effective method which is in line with other SMT components in the assembly process.”
Kapton polyimide film remains stable across a wide range of temperatures and is suitable for use in high-temperature SMT manufacturing. Providing flexibility for a variety of design applications, the 1.27-mm pitch, vertical SMT modular jacks with Kapton tape are available in RJ-11 and RJ-45 formats. In addition, to accommodate tight board stacking requirements, low-profile versions are available.
Molex Vertical surface mount (SMT) Modular Jacks are fully compliant with TIA-1096-A and IEC60603-7 PL2 standards.
Molex Inc.
www.molex.com
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