Test show a temperature rise of 30°C for current up to 8.5 A per pin.
I/O
Signal integrity can’t kill the breakout box
Just when you thought the trusty breakout box would fall victim to high-speed digital signals, it lives on
Small form-factor pluggable interconnects provide high density and speed
TE Connectivity has extended its small form-factor pluggable (SFP) product portfolio with new, small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects. The “double density” new cages and surface mount connectors can offer two-channel data transmission, instead of the traditional one-channel in an SFP architecture, which helps data center systems to enable doubled […]
