TE Connectivity (TE) presented its 2017 Distributor Awards during its recent Regional Distribution Summits held in Shanghai; Bad Neuenahr, Germany; and Orlando. The annual awards recognize TE’s highest-performing distribution partners in a specific region based on sales growth, business plan realization, customer growth and training participation. TE presented the 2017 Regional Distributor of the Year […]
TE Connectivity increases availability of SEACON Micro WET-CON connectors
TE Connectivity (TE) announced today plans to implement two improvements to its SEACON Micro WET-CON connectors that will result in faster product turn-around and expedited delivery to customers. Lead-Free and RoHS Compliant – In order to meet international standards, TE Connectivity began manufacturing all Micro WET-CON connectors lead-free and Restriction of Hazardous Substances Directive (RoHS) […]
TE Connectivity introduces 48V bus bar connectors and cable assemblies at the 2018 OCP Summit
TE Connectivity (TE) today announced its new 48-V bus bar connectors and cable assemblies, designed to meet next-generation 48-V application requirements including the Open Compute Project (OCP) Open Rack Standard V2.0 designs. These products will be showcased for the first time at TE’s booth B23 during the OCP Summit in San Jose, Calif. March 20 […]
TE Connectivity showcases 400G connector and cable assembly solutions at OFC 2018
TE Connectivity (TE) will showcase a comprehensive lineup of high-performance connectors, sockets, cable assemblies and power solutions at the OFC 2018 conference held in San Diego, March 13 −15. TE will show these solutions in the Ethernet Alliance booth (#2648) and the Optical Internetworking Forum (OIF) booth (#5525) throughout the show. Experts will be on […]
TE Connectivity reduces high-density switch design costs with zQSFP+ stacked belly-to-belly cage
TE Connectivity (TE) has launched its zQSFP+ stacked belly-to-belly cages, which support a single printed circuit board (PCB) architecture (versus two PCBs) in each line card, saving customers significant costs. Designed for high-density switches with 48 or 64 silicon port designs, TE’s new zQSFP+ stacked belly-to-belly cages address the requirements for higher density switch designs, […]
TE Connectivity releases over 25,000 new digital models in collaboration with SnapEDA
TE Connectivity and SnapEDA, the Internet’s first parts library for circuit board design, are collaborating to make more than 25,000 new digital models available to electronics designers, helping them bring their products to market faster. Traditionally, designers have spent days creating models for each component in their designs, a tedious and time-consuming process. Some components, […]
TE Connectivity introduces Flex Grip wire connectors for quick and easy wire termination
TE Connectivity (TE) has launched Flex Grip wire connectors for fast, flexible and easy wire termination. The new connectors, which accommodate solid and stranded wires between 24 and 14 AWG (0.2 – 4.00 mm²), feature an operating lever that allows releasable and reworkable wire termination. The transparent housings enable users to visually confirm the proper […]
TE Connectivity highlights 400Gbe OSFP and QSFP-DD connectivity at DesignCon 2018
TE Connectivity (TE) today announced the showcasing of OSFP and QSFP-DD connectivity products at this year’s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE is demonstrating the new products in booth 817 at the DesignCon 2018 expo through tomorrow, February 1 in Santa Clara, Calif. Targeted for […]
TE Connectivty and Credo demonstrate 112G single-lane connectivity at DesignCon 2018
TE Connectivity (TE) and Credo, provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets, today announced they have teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip-to-module (IO) channel and over a backplane channel at DesignCon 2018. […]
TE Connectivity debuts high density power card edge solution for data centers
TE Connectivity (TE) has released its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications. TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25 A/contact with low resistance, and supports 1,500-2,000 W power […]
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