The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group today announced that it has released the microQSFP Specification Version 2.0 allowing system designers, optical module manufacturers and copper cable assembly providers across the industry to develop next-generation hardware based on the microQSFP definition. The microQSFP document includes final electrical, mechanical, thermal and management specifications of the microQSFP module and cage.
The microQSFP transceiver module uses a compact connector system sufficient for four input/output (I/O) electrical channels that supports direct attach copper cable assemblies, optical modules and active optical cable assemblies. Having the same width as the existing single-channel small form-factor pluggable (SFP) form factor, microQSFP ports offer the industry a familiar module, but with up to four times the data capacity.
This new form factor may be used with 1, 2 or 4 channels and its enhanced thermal features offer a way to support more thermally challenging applications. For example, microQSFP products could be used for 1- or 2-channel applications where higher thermal loads are required, such as 1×50 or 2×50 Gigabit per second (Gbps) applications. In these applications, the users benefit from the familiar SFP density, but with significantly higher thermal management.
The microQSFP specification defines an electrical interconnect that provides 33% higher density than the existing QSFP (quad small form-factor pluggable) connector system, along with integrated thermal management features that significantly improve the thermal performance when compared with QSFP style connectors and cages. The microQSFP connector signal integrity performance will support existing industry specifications up to 28 Gbps per channel and it is intended to support 50 Gbps PAM4 requirements as well. It is also intended that future generations of microQSFP connectors will address higher data rates. When operating at 25 Gbps per channel, the solution enables up to 7.2 Terabit per second (Tbps) per 1RU line card with 72 ports.
The founding Promoter members of the MSA include Broadcom, Brocade, Cisco, Dell, Foxconn Interconnect Technology, Huawei, Intel, Juniper Networks, Lumentum, Microsoft, Molex and TE Connectivity. Subsequent Contributor members include Amphenol, Finisar, Lorom, MultiLane, Oclaro, Rosenberger and Semtech. The MSA group is currently soliciting new contributory members to help expand the adoption of microQSFP in the marketplace.
The following members have this to say about the group and the ensuing specifications:
“With the ever expanding need for more bandwidth, front panel density and storage capacity, microQSFP is the natural progression for the existing QSFP connector system”, said Greg McSorley Tech. Bus. Dev. Mgr of Amphenol Corp. “As a contributor to the microQSFP MSA Amphenol looks forward to bringing this solution to our Data Center customers.”
“Foxconn Interconnect Technology, Ltd. is pleased to work with other leading networking companies addressing port density and associated thermal management challenges to enable next generation data communications,” Steve Shultis, Director FOIT Marketing, Foxconn Interconnect Technology.
“The microQSFP provides the opportunity today for the smallest single-port form factor for 100 Gbps Ethernet applications and is expected soon for 200 Gbps Ethernet applications,” said Jeffery J. Maki, Distinguished Engineer, Juniper Networks. “We are pleased to be a part of a working group committed to advancing the industry standard for next-generation data communications.”
“The microQSFP MSA Group has made key advances in thermal management while reducing the size required for a 100G module,” said Brad Booth, principal architect, Azure Networking, Microsoft. “This effort will assist the industry in dealing with increased thermal load as bandwidth demands continue to grow.”
“The industry is trending toward modules that deliver higher data capacity without occupying more real estate, and microQSFP is an important part of that evolution,” said Scott Sommers, group product manager, I/O products and standards, Molex, LLC. “Our agreement on Specification Version 2.0 will help customers implement effective, interoperable solutions.”
“The Multilane SAL team consistently contributes to the trends of physical layer specifications and is proud to be working with the participating parties on the microQSFP form factor. microQSFP modules and cables will further support 100G (and higher) connectivity with higher thermal tolerance while conserving critical port space on server blades,” said Fadi Daou, CEO Multilane SAL.
“TE is proud to be an integral part of the microQSFP MSA to enable the next generation of high density connectivity while also solving fundamental thermal management roadblocks,” said Phil Gilchrist, CTO of TE Connectivity, Data and Devices. “The revolutionary new design has the industry thinking differently about what’s possible as it strives to meet the insatiable demand for more data delivered faster, everywhere.”