Mill-Max has announced a new, low profile solder cup header delivering a 25% reduction in height as compared to its current product. According to officials at the Oyster Bay, N.Y., company, the solder cup headers are ideal for making wire-to-board connections where keeping overall height to a minimum is essential.
The new 380-10-1XX-00-002000 (single row) and 480-10-2XX-00-002000 (double row) products feature a standoff height of 0.185 in. (4.7 mm), 0.100 in. (2.54 mm) pin spacing and 0.020 in. (0.51 mm) diameter tails suitable for mating with a variety of sockets or terminating directly to a PCB.
The insulator material is Nylon 46 with an HDT of 290° C to withstand most soldering processes. The solder cups are uniformly aligned to facilitate efficient soldering, especially useful for terminating cables, and can accept up to 22 AWG stranded wire. When mated with Mill-Max low profile board mounted sockets 315-XX-1XX-41-003000 (single row) or 415-XX-2XX-41-003000 (double row) the total interconnect height is 0.280 in. (7.11 mm). They can also mate with Mill-Max standard solder cup sockets 329-XX-1XX-41-540000 (single row) or 429-XX-2XX-41-540000 (double row) for use in wire termination applications such as cable assemblies.
The solder cup pins are precision turned from brass alloy and are plated with 10 µm gold, providing interconnect reliability, corrosion protection and wear resistance. Connectors are available from 1-64 positions, single row and 2-72 positions double row.