Molex introduces Pico-EZmate Slim

To meet industry’s need for a compact, wire-to-board connector with vertical mating, Molex, Lisle, Ill., has introduced the Pico-EZmate Slim 1.2-mm pitch wire-to-board connector. According to the company, it’s designed to provide reliable connection in a compact profile that improves both reliability and assembly speed.

Pico-EZmate Slim 1.2-mm pitch wire-to-board connector

“As consumer electronics products get more compact, manufacturers are looking to reduce the overall device size while not sacrificing reliability or production flexibility,” said Rick Lee, global product manager, Molex. “By creating both a profile height of 1.2 mm and including a vertical mating design, Molex has addressed the changing needs of the industry in a small, powerful package.”

The Pico-EZmate product’s vertical mating design allows for fast and reliable assembly without the risk of improperly orienting or mating the connection. Polarization keys provide a further level of safety by preventing the mismating of the plug.

It is suited for use in mobile phones and tablets, entertainment devices and appliances. According to Molex, the unit is best suited for electronics applications where device space is at a premium and manufacturing efficiency is essential. It also reduces the overall PCB footprint in the device, compared to other connectors.

Molex
www.molex.com