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Telecom/Data

Chip size 0.65mm pitch BGA socket adapter for DDR4

April 5, 2016 By Abby Esposito Leave a Comment

Ironwood Electronics’ new high performance socket – SFS-BGA200B-52 allows 0.65mm pitch, 11×14.5mm body, 12X22 array 200 ball BGA package to be placed in socket and operated without compromising performance in high speed applications. The Giga-snaP BGA socket adapter pair consists of SFS-BGA200B-52, patented female BGA sockets with BeCu pins assembled into a substrate that matches […]

Filed Under: Telecom/Data Tagged With: ironwoodelectronics

40 GHz bandwidth ATE socket for BGA240

April 5, 2016 By Abby Esposito Leave a Comment

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064×6.464 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is […]

Filed Under: Electrical/Instrumentation, Telecom/Data Tagged With: ironwoodelectronics

OCuLink connectors and cables support new PCIe standard

March 31, 2016 By Mary Gannon Leave a Comment

OcuLink X4 Receptacle Connector

By Ed Cady, Contributing Editor OCuLink-2—Optical Copper (Cu) Link 2nd generation—is an interconnect system for inside and outside the box that supports the new PCI Express 4.0 spec running at 16 Gbps per lane. The PCI-SIG committee selected Molex’s NanoPitch connector and cable assembly system for this OCuLink spec and it is an option for […]

Filed Under: Basics, Industry News, Mary Gannon's blog, Products, Telecom/Data Tagged With: Amphenol, Molex

Nano-Pitch I/O 80-circuit interconnect debuts at DesignCon 2016

March 10, 2016 By Abby Esposito Leave a Comment

At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O 80-Circuit Interconnect System, which offers the highest port density (number of high-speed differential lanes) and speed (25 Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an […]

Filed Under: Telecom/Data Tagged With: Molex

Gen 6 32Gb fiber channel portfolio

March 8, 2016 By Abby Esposito Leave a Comment

ATTO Technology, Inc.has announced the availability of its new Gen 6 Fibre Channel product portfolio. With a 20-year track record of Fibre Channel innovation, the announcement confirms ATTO’s position as a provider of next-generation solutions that solve the highest bandwidth demands for content creation and enterprise markets. The new Gen 6 line includes Celerity 32Gb […]

Filed Under: Electrical/Instrumentation, Products, Telecom/Data Tagged With: attotechnology

CableEye Micromatch connector board CB49

March 7, 2016 By Abby Esposito Leave a Comment

CAMI Research Inc. has announced a new board for its CableEye cable and harness testing systems. Populated with solder pads to accept a suite of TE-Connectivity Micro-MaTch connectors, the board addresses markets plagued by vibration and fretting corrosion, and requiring “miniaturized connectivity”. Rated to 500Vdc/350Vac, the CB49 may be used on all CableEye models. CAMI […]

Filed Under: Electrical/Instrumentation, Markets, Telecom/Data Tagged With: CableEye

TE announces further expansion of optical connector portfolio

March 2, 2016 By Abby Esposito Leave a Comment

TE Connectivity Ltd. has announced the launch of MC801 fiber optical connectors. This product supports numerous high-speed protocols, offering low insertion loss across multiple connector breaks, through the use of physical contact optical technology. The increasing demand for secure high-speed data and signal transfer communication within the Aerospace and Defense industries, is expected to be […]

Filed Under: Telecom/Data Tagged With: teconnectivity

Molex debuts Impel backplane connectors at DesignCon

January 21, 2016 By Mary Gannon Leave a Comment

Molex-TH-Impel_Family_DesignCon-2016-Overview Backplane connectors

Molex, LLC debuted its new Impel Plus Backplane Connectors at the DesignCon 2016 Expo this week. An extension of the Impel Backplane Connector family, Impel Plus connectors include grounding tail aligners and smaller signal compliant pins. An innovative signal beam design improves insertion loss compared to in-line beams and pushes interface resonance frequency past 30 […]

Filed Under: Aerospace, Markets, Medical, Military, Products, Telecom/Data Tagged With: Molex

TE Connectivity showcases latest data connectors at DesignCon 2016

January 19, 2016 By Mary Gannon Leave a Comment

TE-Connectivity-mQ-Family-12-23-15

TE Connectivity (TE) today announced that it will showcase a range of industry-leading data communications connectivity solutions in booth 811 at the DesignCon 2016 Expo in Santa Clara, Calif.  January 20-21. TE will offer both working demonstrations and displays of the latest data connector products delivering the speed, scalability, space-savings, reduced thermals, power and reach […]

Filed Under: Industry News, Products, Telecom/Data Tagged With: teconnectivity

microQSFP MSA Group releases specification for next-gen datacom connectivity

January 18, 2016 By Mary Gannon Leave a Comment

microQSFP comparson

The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group released draft mechanical specifications of the microQSFP module and cage. The module and cage draft mechanical details allow system designers, optical module makers and copper cable assembly providers across the industry to begin the process of developing next-generation hardware based on […]

Filed Under: Industry News, Markets, Products, Telecom/Data Tagged With: foxconn, Molex, teconnectivity

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