Molex introduces the Brad DeviceNet HarshIO M8 Modules, the first on the market to come fully ODVA conformance tested and approved. Offering full M8 connectivity for power, I/O and DeviceNet fieldbus this module provides a unique IP67-rated, small form-factor solution for high-density machine I/O connections for CNC and robotic machines, as well as material handling […]
ERNI connectors optimize industrial automation connectivity
ERNI continues to expand its connector product offering to meet the growing demands of industrial control networks and motion control/drive systems. Modern industrial automation networks utilizing programmable logic/automation controllers (PLCs/PACs), distributed control systems (DCSs), and motion control and drive systems need to handle more data traffic at increased speeds, and often in demanding environments with […]
TE Connectivity releases 3-in-2 memory card connectors
TE Connectivity (TE) released its 3-in-2 card connector, for enabling SIM and micro SD card connectivity in mobile phones, tablets, ultraportable devices and personal computers. This card connector’s space-efficient design features two cavities with the flexibility to accept either two SIM cards or one SIM card and one micro SD card. It saves about 20% […]
ODU highlights expanded hybrid circular connectors
ODU MINI-SNAP circular connectors feature a push-pull locking mechanism for a self-securing design for a wide range of applications. They can transfer power, signal, data or media. ODU’s Push-Pull principle reliably ensures that the connection never releases until you want it to. Once mated, the ODU MINI-SNAP locks itself into the receptacle. The mated connector […]
TE Connectivity expands partnership with Arrow Electronics for its Microdot connector line
TE Connectivity (TE) recently announced an expanded distributor partnership with Arrow Electronics as a value-add partner for TE’s Microdot connector product line. The relationship allows Arrow to produce MICRODOT connector products per MIL-DTL-83513, and stock all components required to assemble various Micro D connector sizes, to offer customers a quick-turn solution. TE’s MICRODOT connector product […]
Molex Introduces Impact zX2 backplane connector system for high-speeds
Molex has released the Impact zX2 backplane connector system, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilizes Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data […]
ODU expands it ODU-MAC modular hydrid connector lines
ODU is promoting to the U.S. market its advanced modular hybrid connector solutions designed for high reliability rugged test platforms. Dubbed the ODU-MAC line, these designs use ODU’s modular nature and its spindle locking system for easy connection and disconnection. The ODU-MAC portfolio includes: ODU-MAC White-Line that offers manual mating up to 100,000 mating cycles; […]
Behind TE Connectivity’s new Sliver internal cabled interconnects
Last month, TE Connectivity launched one of its thinnest assemblies for speeds of 25 Gbps (and even possibly 50 Gbps) with its new Sliver internal cabled interconnects. Offering a flexible design for making internal input/output (I/O) connections on the board, TE said this new technology simplifies design and helps lower overall costs by eliminating the […]
TE Connectivity will showcase space and weight savings products at IDEX 2017
TE Connectivity (TE) will showcase lightweight connectivity solutions for rugged military defense systems at booth #03-C27 for IDEX 2017, an international strategic defense exhibition and conference. Nothing is more important on the battlefield than having a reliable system. As military and defense systems grow more complex, electronic soldier systems, weapon systems, and unmanned vehicles must […]
WAGO adds senior sales and application engineer
WAGO announces the addition of Sergio Vergara as Senior Sales and Application Engineer of Eastern Canada. Vergara was born in Colombia and received his degree in Electrical Engineering from La Universidad de Los Andes in Bogotá. Upon graduating he began his career working as a Project Engineer for Proctek, ABB then Invensys (later acquired by […]